Semiconductor Device

ABSTRACT

The present invention provides a non-insulated type DC-DC converter having a circuit in which a power MOS·FET for a high side switch and a power MOS·FET for a low side switch are connected in series. In the non-insulated type DC-DC converter, the power transistor for the high side switch, the power transistor for the low side switch, and driver circuits that drive these are respectively constituted by different semiconductor chips. The three semiconductor chips are accommodated in one package, and the semiconductor chip including the power transistor for the high side switch, and the semiconductor chip including the driver circuits are disposed so as to approach each other.

CROSS-REFERENCE TO RELATED APPLICATION

The present invention claims priority from Japanese patent applicationNo. 2004-106224 filed on Mar. 31, 2004, the content of which is herebyincorporated by reference into this application.

BACKGROUND OF THE INVENTION

The present invention relates to a semiconductor device technique, andparticularly to a technique effective when applied to a semiconductordevice having a power supply circuit.

In order to attain adaptation to miniaturization of a power supplycircuit or the like and its fast response, a power MOS·FET (Metal OxideSemiconductor Field Effect Transistor) used in a power supply has beenproceeding toward an increase in high frequency in recent years.

In particular, a non-insulated type DC-DC converter used as a powersupply circuit for a desk top type or notebook personal computer, aserver or a game machine or the like has a tendency to increase incurrent and frequency with respect to a CPU (Central Processing Unit)and a DSP or the like to be controlled.

A DC-DC converter widely used as one example of a power supply circuithas a configuration wherein a power MOS·FET for a high side switch and apower MOS·FET for a low side switch are connected in series. The powerMOS·FET for the high side switch has a switch function for control ofthe DC-DC converter, whereas the power MOS·FET for the low side switchhas a switch function for synchronous rectification. The two powerMOS·FETs are alternately turned on/off while being synchronized witheach other to perform conversion of a source or power supply voltage.

Such a DC-DC converter has been described in, for example, JapaneseUnexamined Patent Publication No. 2002-217416, which discloses atechnique wherein a power MOS·FET for high side and a power MOS·FET forlow side are configured with the same package, and the efficiency ofvoltage conversion between the power MOS·FET for high side and the powerMOS·FET for low side is improved (refer to a patent document 1).

A technique wherein noise showing a problem at a DC-DC converter inwhich a control circuit, a driver circuit and a power MOS·FET arebrought into one chip, is reduced by a resistor and a condenser, hasbeen disclosed in, for example, Japanese Unexamined Patent PublicationNo. 2001-25239 (refer to a patent document 2).

Patent Document 1

-   Japanese Unexamined Patent Publication No. 2002-217416

Patent Document 2

-   Japanese Unexamined Patent Publication No. 2001-25239

SUMMARY OF THE INVENTION

As a result of discussions about a further size reduction, speeding-upand increase in efficiency of the DC-DC converter, the present inventorshave found out the existence of the following problems.

The patent document 1 has disclosed the technique of incorporating twoconductor chips of a switch semiconductor chip for a high side powerMOS·FET and a switch semiconductor chip for a low side power MOS·FETinto the same resin molded type package. However, no detailed mention ismade of control circuits for controlling on/off operations of theswitches, in other words, driver circuits for driving the gates of thepower MOS·FETs. When the driver circuits are configured by differentpackages including different semiconductor chips, the number of partsfor constituting the DC-DC converter increases and hence a packagingarea becomes large. Thus, there is a fear that a size reduction of theDC-DC converter cannot be achieved sufficiently. Further, there is afear that since there is a need to route wirings on a mounting board toconnect the two different packages, losses occur due to inductancesparasitized on the routing wirings and hence the efficiency of voltageconversion will be degraded. The proportion of the losses isparticularly noticeable where an increase in high frequency hasproceeded.

The patent document 1 does not refer particularly to the controlcircuits for controlling the driver circuits.

When the control circuits for controlling the driver circuits, thedriver circuits and the power MOS·FETs are brought into one chip as inthe patent document 2, a reduction in the size of a semiconductor devicefor constituting the DC-DC converter can be realized. However, theprocess of manufacturing a chip becomes complicated. There is thus afear that respective semiconductor elements and circuit characteristicsare not brought out sufficiently. Therefore, there is a fear that thespeeding up of the DC-DC converter and an increase in efficiency thereofcannot be achieved sufficiently. There is also a fear that time isrequired for chip manufacture and the manufacturing cost increases.

Important objectives are how to adapt to a large current and an increasein frequency and to obtain a DC-DC converter small in size and high inthe efficiency of voltage conversion in order to reduce or solve theabove fears.

One object of the present invention is to provide a technique capable ofimproving voltage conversion efficiency of a semiconductor device.

Another object of the present invention is to provide a techniquecapable of scaling down a package of a semiconductor device.

A further object of the present invention is to provide a techniquecapable of reducing manufacturing cost of a semiconductor device.

A still further object of the present invention is to provide atechnique capable of attaining an improvement in reliability of asemiconductor device.

The above, other objects and novel features of the present inventionwill become apparent from the description of the present specificationand the accompanying drawings.

A summary of a representative one of the inventions disclosed in thepresent application will be explained in brief as follows:

In the present invention, a power transistor for a high side switch, apower transistor for a low side switch, and driver circuits that drivethese are respectively constituted of different semiconductor chips. Thethree semiconductor chips are accommodated or held in one package.Further, the semiconductor chip including the power transistor for thehigh side switch, and the semiconductor chip including the drivercircuits are disposed so as to approach each other. Described morespecifically, a semiconductor device of the present invention comprises:

a first chip mounting section, a second chip mounting section and athird chip mounting section respectively disposed at predeterminedintervals;

a plurality of external terminals disposed around the first, second andthird chip mounting sections;

a first semiconductor chip disposed over the first chip mounting sectionand having a first field effect transistor;

a second semiconductor chip disposed over the second chip mountingsection and having a second field effect transistor;

a third semiconductor chip disposed over the third chip mounting sectionand including control circuits for controlling the operations of thefirst and second field effect transistors; and

a resin body that encapsulates the first, second and third semiconductorchips, the first, second and third chip mounting sections and some ofthe plurality of external terminals,

wherein the plurality of external terminals include a first power supplyterminal that supplies an input power supply potential, a second powersupply terminal that supplies a potential lower than the input powersupply potential, signal terminals that control the control circuits ofthe third semiconductor chip, and an output terminal that outputs anoutput power supply potential to the outside,

wherein the first field effect transistor has a source-to-drain pathseries-connected between the first power supply terminal and the outputterminal,

wherein the second field effect transistor has a source-to-drain pathseries-connected between the output terminal and the second power supplyterminal,

wherein the control circuits of the third semiconductor chip control thegates of the first and second field effect transistors in accordancewith control signals inputted to the signal terminals, and

wherein the third semiconductor chip is disposed in such a manner thatthe distance between the third semiconductor chip and the firstsemiconductor chip becomes shorter than the distance between the thirdsemiconductor chip and the second semiconductor chip.

Advantageous effects obtained by a representative one of the inventionsdisclosed in the present application will hereinafter be described inbrief as follows:

In the present invention, a power transistor (first field effecttransistor) for a high side switch, a power transistor (second fieldeffect transistor) for a low side switch, and driver circuits (controlcircuits) that drive these are respectively constituted of differentfirst through third semiconductor chips. Further, the threesemiconductor chips are accommodated or held in one package.Furthermore, the first semiconductor chip including the power transistor(first field effect transistor) for the high side switch, and the thirdsemiconductor chip including the driver circuits (control circuits) aredisposed so as to approach each other. Thus, the optimum semiconductordevice forming technology can be applied to constitute necessary circuitblocks. Further, the number of parts can be reduced. Furthermore,parasitic inductance components of wirings located inside and outside apackage, which greatly influence high frequency characteristics, can bereduced. Thus, the speeding-up, downsizing and increasing efficiency ofa semiconductor device can be achieved.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a circuit diagram showing one example of a semiconductordevice according to a first embodiment of the present invention;

FIG. 2 is a circuit diagram illustrating one example of a controlcircuit of the semiconductor device shown in FIG. 1;

FIG. 3 is a diagram for describing one example of a timing chart of thesemiconductor device shown in FIG. 1;

FIG. 4 is an equivalent circuit diagram showing inductance componentsparasitized on a semiconductor device discussed by the presentinventors;

FIG. 5 is a diagram for describing a circuit operation discussed by thepresent inventors;

FIG. 6 is a diagram for describing a device section at the circuitoperation of FIG. 5;

FIG. 7 is a diagram for describing one example of a configuration of thesemiconductor device shown in FIG. 1;

FIG. 8 is a plan view showing one example of a package configuration ofthe semiconductor device shown in FIG. 1;

FIG. 9 is a cross-sectional view taken along line Y1-Y1 of FIG. 8;

FIG. 10 is an assembly flow diagram showing a method for manufacturingthe semiconductor device according to the first embodiment of thepresent invention;

FIG. 11 is a plan view illustrating one example of a unit area of a leadframe of the semiconductor device according to the first embodiment ofthe present invention;

FIG. 12 is a plan view depicting the back surface of the unit area ofthe lead frame shown in FIG. 11;

FIG. 13 is a plan view of the unit area of the lead frame, showing oneexample of an assembled state associated with steps of the assembly flowdiagram shown in FIG. 10;

FIG. 14 is a plan view of the unit area of the lead frame, showing oneexample of an assembled state associated with steps of the assembly flowdiagram shown in FIG. 10;

FIG. 15 is an enlarged plan view showing a semiconductor chip formedwith a power MOS·FET on the high side, which is employed in the firstembodiment of the present invention;

FIG. 16 is a cross-sectional view taken along line B-B of FIG. 15;

FIG. 17 is a fragmentary enlarged cross-sectional view of thesemiconductor chip of the semiconductor device shown in FIG. 16;

FIG. 18 is a cross-sectional view taken along line C-C of FIG. 15;

FIG. 19 is an enlarged plan view showing a semiconductor chip formedwith a power MOS·FET on the low side, which is employed in the firstembodiment of the present invention;

FIG. 20 is a circuit configuration diagram illustrating control circuitsof the semiconductor device shown in FIG. 1;

FIG. 21 is a diagram for describing a section of the control circuit ofthe semiconductor device shown in FIG. 1;

FIG. 22 is a plan view showing one example of a packaged state of thesemiconductor device according to the first embodiment of the presentinvention;

FIG. 23 is a side view illustrating the semiconductor device shown inFIG. 21;

FIG. 24 is an overall plan view showing a surface side of asemiconductor device according to one embodiment of the presentinvention;

FIG. 25 is a side view illustrating the semiconductor device shown inFIG. 24;

FIG. 26 is an overall plan view showing the back surface side of thesemiconductor device shown in FIG. 24;

FIG. 27 is an overall perspective view illustrating an externalappearance of the semiconductor device according to the one embodimentof the present invention;

FIG. 28 is a plan view showing one example of a package configuration ofa semiconductor device according to a second embodiment of the presentinvention;

FIG. 29 is a plan view illustrating one example of a packageconfiguration of a semiconductor device according to a third embodimentof the present invention;

FIG. 30 is a plan view showing one example of a package configuration ofa semiconductor device according to a fourth embodiment of the presentinvention;

FIG. 31 is a plan view depicting one example of a package configurationof a semiconductor device according to a fifth embodiment of the presentinvention;

FIG. 32 is a plan view illustrating one example of a packageconfiguration of a semiconductor device according to a sixth embodimentof the present invention;

FIG. 33 is a cross-sectional view taken along line D-D of FIG. 32;

FIG. 34 is an assembly flow diagram showing a method for manufacturingthe semiconductor device according to the sixth embodiment of thepresent invention;

FIG. 35 is a plan view illustrating one example of the surface side of aunit area of a lead frame employed in a semiconductor device accordingto a seventh embodiment of the present invention;

FIG. 36 is a plan view showing one example of the back surface side ofthe unit area of the lead frame shown in FIG. 35;

FIG. 37 is a plan view illustrating one example of the surface side of aunit area of a lead frame employed in a semiconductor device accordingto an eighth embodiment of the present invention;

FIG. 38 is a plan view showing the back surface side of the unit area ofthe lead frame shown in FIG. 37;

FIG. 39 is a plan view illustrating one example of the surface side of aunit area of a lead frame employed in a semiconductor device accordingto a ninth embodiment of the present invention;

FIG. 40 is a plan view showing the back surface side of the unit area ofthe lead frame shown in FIG. 39;

FIG. 41 is a plan view illustrating one example of a packageconfiguration of a semiconductor device according to a tenth embodimentof the present invention;

FIG. 42 is a cross-sectional view taken along line E-E of FIG. 41;

FIG. 43 is an assembly flow diagram showing a method for manufacturing asemiconductor device according to an eleventh embodiment of the presentinvention;

FIG. 44 is an assembly flow diagram illustrating a method formanufacturing a semiconductor device according to a twelfth embodimentof the present invention;

FIG. 45 is a plan view depicting one example of a package configurationof a semiconductor device according to a thirteenth embodiment of thepresent invention;

FIG. 46 is a cross-sectional view taken along line F-F of FIG. 45;

FIG. 47 is an overall plan view showing the surface side of thesemiconductor device shown in FIG. 45;

FIG. 48 is a plan view illustrating one example of a packageconfiguration of a semiconductor device according to a fourteenthembodiment of the present invention;

FIG. 49 is a cross-sectional view taken along line G-G of FIG. 48;

FIG. 50 is an overall plan view showing the surface side of thesemiconductor device shown in FIG. 48;

FIG. 51 is a plan view illustrating one example of a packageconfiguration of a semiconductor device according to a fifteenthembodiment of the present invention;

FIG. 52 is a cross-sectional view taken along line H-H of FIG. 51;

FIG. 53 is an overall plan view showing the surface side of thesemiconductor device shown in FIG. 51; and

FIG. 54 is a diagram for describing one example of a circuitconfiguration of a semiconductor device of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Whenever circumstances require it for convenience in the followingembodiments, they will be described by being divided into a plurality ofsections or embodiments. However, unless otherwise specified inparticular, they are not irrelevant to one another. One thereof has todo with modifications, details and supplementary explanations of some orall of the other. When reference is made to the number of elements orthe like (including the number of pieces, numerical values, quantity,range, etc.) in the following embodiments, the number thereof is notlimited to a specific number and may be greater than or less than orequal to the specific number unless otherwise specified in particularand definitely limited to the specific number in principle. It is alsoneedless to say that components (including element or factor steps,etc.) employed in the following embodiments are not always essentialunless otherwise specified in particular and considered to be definitelyessential in principle. Similarly, when reference is made to the shapes,positional relations and the like of the components or the like in thefollowing embodiments, they will include ones substantially analogous orsimilar to their shapes or the like unless otherwise specified inparticular and considered not to be definitely so in principle, etc.This is similarly applied even to the above-described numerical valuesand range. Those each having the same function in all the drawings fordescribing the embodiments are respectively given the same referencenumerals and their repetitive description will be omitted. The preferredembodiments of the present invention will hereinafter be described indetail based on the accompanying drawings.

First Preferred Embodiment

A semiconductor device according to a first embodiment is of, forexample, a non-insulated type DC-DC converter employed in a power supplycircuit for a disk top type personal computer, a notebook-size personalcomputer, a server or a game machine or the like. FIG. 1 shows a circuitdiagram of one example of the non-insulated type DC-DC converter. Thenon-insulated type DC-DC converter has elements like a control circuit2, driver circuits 3 a and 3 b, field effect transistors (powerMOS·FETs) Q1 and Q2, a coil L1, a condenser or capacitor C1, etc. Theseelements are mounted on a wiring board and electrically connected to oneanother through wirings of the wiring board. Incidentally, referencenumeral 4 in FIG. 1 indicates a load circuit like a CPU (CentralProcessing Unit) or DSP (Digital Signal Processor) for the disk top typepersonal computer, notebook-size personal computer, server or gamemachine. Symbols ET1, ET2 and ET3 indicate terminals respectively. Asshown in FIG. 54, such a non-insulated type DC-DC converter 1 is placedso as to be parallel-connected in plural form with respect to one CPU.

The control circuit 2 is a circuit which supplies a signal that controlsa width (on time) for voltage switch-on of each of the field effecttransistors Q1 (first field effect transistor) and Q2 (second fieldeffect transistor). The control circuit 2 is packaged aside from thefirst field effect transistor Q1, the second field effect transistor Q2,and the driver circuits 3 a and 3 b. The output of the control circuit 2is electrically connected to its corresponding inputs of the drivercircuits 3 a (hereinafter also called first control circuit) and 3 b(hereinafter also called second control circuit). The first controlcircuit 3 a and the second control circuit 3 b are circuits whichrespectively control the gates of the first and second field effecttransistors Q1 and Q2 in accordance with the control signal suppliedfrom the control circuit 2. The first and second control circuits 3 aand 3 b are respectively formed of, for example, a CMOS invertercircuit. One example of a circuit diagram of the first control circuit 3a is shown in FIG. 2. The first control circuit 3 a has a circuitconfiguration in which a p channel type field effect transistor Q3 andan n channel type field effect transistor Q4 are complementarilyconnected in series. Incidentally, symbols D, G and S in FIG. 2respectively indicate a drain, a gate and a source. The control circuit3 a is controlled based on a control signal IN1 and controls the levelof an output OUT1 through the field effect transistor Q1.

As shown in FIG. 5, the inputs (IN1) of first and second controlcircuits 3 a and 3 b are electrically connected to their correspondingterminals (signal terminals) supplied with a control signal from thecorresponding control circuit 2. The outputs of the first and secondcontrol circuits 3 a and 3 b are respectively electrically connected tothe gates of first and second field effect transistors Q1 and Q2. Thefirst and second field effect transistors Q1 and Q2 are series-connectedbetween a terminal ET1 (first power or power supply terminal) suppliedwith an input power supply potential Vin and a terminal ET4 (secondpower or power supply terminal) supplied with a reference potential GND.The input power supply potential Vin ranges from approximately 5 to 12V,for example. The reference potential GND is, for example, a power supplyor source potential lower than the input power supply potential, e.g., 0(zero) V corresponding to a ground potential. An operating frequency(corresponding to a cycle taken when the first and second field effecttransistors Q1 and Q2 are turned on and off) of the non-insulated typeDC-DC converter 1 is about 1 MHz or so, for example.

The first field effect transistor Q1 is intended for a high side switch(high potential side: first operating voltage) and has a switch functionfor storing energy in the coil L1 for supplying power to an output Vout(input of load circuit 4) of the non-insulated type DC-DC converter 1.The first field effect transistor Q1 is formed of a vertical fieldeffect transistor in which a channel is formed in the direction ofthickness of a chip. According to the discussions of the presentinventors, in the field effect transistor Q1 for the high side switch,switching losses (turn-on loss and turn-off loss) comes into sight in alarge way due to a parasitic capacitance added thereto as the operatingfrequency of the non-insulated type DC-DC converter 1 becomes high.Thus, it is desired that if ordinary, a horizontal field effecttransistor in which a channel is formed in the surface (direction normalto the chip's thickness direction) of the chip, is applied as the fieldeffect transistor for the high side switch in consideration of theswitching losses. This is because a parasitic capacitance (gateparasitic capacitance) applied between the gate and drain can be reducedsince the horizontal field effect transistor is smaller than thevertical field effect transistor in terms of an area at which a gateelectrode and a drain region overlap.

It is however disadvantageous to bring each element into less sizebecause when an attempt is made to obtain a value nearly equal to thatof the vertical field effect transistor as the resistance (onresistance) produced at the operation of the horizontal field effecttransistor, the cell area of the horizontal field effect transistorbecomes about 2.5 times as large as or more than the cell area of thevertical field effect transistor. In the case of the vertical fieldeffect transistor, a channel width per unit area can be increased ascompared with the horizontal field effect transistor, so that the onresistance can be reduced. That is, the formation of the first fieldeffect transistor Q1 for the high side switch by the vertical fieldeffect transistor makes it possible to realize a reduction in the sizeof each element and bring packaging into less size.

On the other hand, the second field effect transistor Q2 is of a fieldeffect transistor for a low side switch (low potential side: secondoperating voltage) and also serves as a rectifying transistor of thenon-insulated type DC-DC converter 1. The second field effect transistorQ2 has the function of reducing the resistance of the transistor in syncwith a frequency sent from the control circuit 2 to performrectification. The second field effect transistor Q2 is formed of avertical field effect transistor in which a channel is formed in thedirection of thickness of the chip, in a manner similar to the firstfield effect transistor Q1. It is advantageous to apply the verticalfield effect transistor because a loss due to the on resistance ratherthan the switching losses comes into sight in a large fashion since thetime (on time) during which the voltage is being applied to the fieldeffect transistor for the low side switch, becomes longer than the ontime of the field effect transistor for the high side switch as shown inFIG. 3. That is, the formation of the second field effect transistor Q2for the low side switch by the vertical field effect transistor makes itpossible to reduce the on resistance. Therefore, even if current thatflows through the non-insulated type DC-DC converter 1 increases, theefficiency of voltage conversion can be improved.

An output terminal ET5 for supplying an output power supply potential tothe outside is provided between wirings for connecting the source of thefirst field effect transistor Q1 and the drain of the second fieldeffect transistor Q2. An output wiring is electrically connected to theoutput terminal ET5. Also the coil L1 is electrically connected to theoutput wiring. At a stage subsequent to the coil L1, the condenser C1 iselectrically connected between the output wiring and a terminal forsupply of the reference potential GND.

In such a circuit, the first and second field effect transistors Q1 andQ2 are alternately turned on and off while being kept synchronized witheach other to thereby perform conversion of the power supply voltage.That is, when the first field effect transistor Q1 for the high sideswitch is turned on, a current (first current) I1 flows from the firstpower supply terminal electrically connected to the drain of the firstfield effect transistor Q1 to the output terminal via the first fieldeffect transistor Q1. When the first field effect transistor Q1 for thehigh side switch is turned off, a current I2 flows due to a backelectromotive voltage of the coil L1. Turning on the second field effecttransistor Q2 for the low side switch when the current I2 is flowing,makes it possible to reduce a voltage drop. FIG. 3 referred to aboveshows one example of a timing chart of the non-insulated type DC-DCconverter 1. As described above, the on time of the second field effecttransistor Q2 for the low side switch is longer than the on time of thefirst field effect transistor Q1 for the high side switch. Ton indicatesa pulse width at the turning-on of the first field effect transistor Q1for the high side switch, and T indicates a pulse cycle. The current I1is a large current of about 20 A, for example.

Meanwhile, the required drive current of the non-insulated type DC-DCconverter 1 has also been increased in recent years with an increase indrive current of the load circuit 4. There has also been a demand for asize reduction of the non-insulated type DC-DC converter 1. Further, therequired operating frequency of the non-insulated DC-DC converter 1 hasalso been increased to supply a low voltage stably. The reason why thedemand for the size reduction of the non-insulated type DC-DC converter1 is made, is that it is preferable to make its size reduction in viewof the fact that in addition to a demand for an overall size reductionin semiconductor device, its size reduction enables shortening of thedistance between the non-insulated type DC-DC converter 1 and the loadcircuit 4, and a large current is supplied to the load circuit 4 in ashort period of time. Another reason why the operating frequency of thenon-insulated type DC-DC converter 1 is made high, is that the number ofunit elements such as the coil L1 and the condenser C1 can be reduced,and the coil L1 and the condenser C1 can be brought into less size.

However, the present inventors have found the problem that with theabove progress of the increases in current and frequency, the efficiencyof voltage conversion of such a non-insulated type DC-DC converter 50 asshown in FIG. 4 is degraded due to influences of an inductance LsHparasitized on the source side of a first field effect transistor Q1 fora high side switch, an inductance LgH parasitized on the gate sidethereof, and an inductance LsL parasitized on the source side of asecond field effect transistor Q2 for a low side switch. FIG. 4 is anequivalent circuit diagram showing inductance components parasitized onthe non-insulated type DC-DC converter 50. Symbols LdH, LgH, LsH, LdL,LgL and LsL respectively indicate inductances parasitized on packages ofthe first and second field effect transistors Q1 and Q2 and wirings orthe like of a printed wiring board. VgH indicates a gate voltage forturning on the first field effect transistor Q1, and VgL indicates agate voltage for turning on the second field effect transistor Q2.

When the parasitic inductance LsH increases, a turn-on loss and aturn-off loss (turn-on loss in particular) of the first field effecttransistor Q1 for the high side switch become large significantly, sothat the efficiency of voltage conversion of the non-insulated typeDC-DC converter 50 is degraded. The turn-on loss and the turn-off lossare proportional to the frequency and output current, loss componentsbecome large with the progress of the increases in current and frequencyof the non-insulated type DC-DC converter 50 as described above.

A description will next be made of the reason why when the parasiticinductance LsH increases, the turn-on and the turn-off become slow, andthe turn-on loss and the turn-off loss increase. FIG. 5 is a diagram fordescribing a circuit operation of a non-insulated type DC-DC converter50, and FIG. 6 is a diagram for describing a device section at thecircuit operation of FIG. 5, respectively.

When the gate voltage of the first field effect transistor Q1 for thehigh side switch exceeds a threshold voltage and a current (firstcurrent) I1 starts to flow from a drain region DR1 of the first fieldeffect transistor Q1 to a source region SR1 thereof, a backelectromotive force (LsH×di/dt) occurs due to the parasitic inductanceLsH, and a source potential of the first field effect transistor Q1 forthe high side switch becomes higher than at points A of FIGS. 4, 5 and6. Since the gate voltage of the first field effect transistor Q1 issupplied from a driver circuit 3 a with the point A as the reference,the voltage applied between a gate region G1 and the source region SR1of the first field effect transistor Q1 for the high side switch becomeslower than a gate voltage VgH. Thus, since a channel resistance R1 ofthe first field effect transistor Q1 for the high side switch is notsufficiently lowered, the loss of the current I1 occurs. That is, theturn-on time becomes long. The reason why the turn-on loss and turn-offloss increase with the increase in power and frequency as describedabove, is that the back electromotive force (LsH×di/dt) increases withthe increase in power and frequency.

Since the first field effect transistor Q1 for the high side switch hasa switch function for storing energy in the coil L1 that supplies powerto the output (input of load circuit 4) of the non-insulated type DC-DCconverter 1, the speeding up of a switching operation is required uponthe increase in frequency. Since, however, the parasitic inductance LgHoccurs between the first control circuit 3 a and the first field effecttransistor Q1, the switching operation becomes slow. That is, aswitching loss is produced so that the efficiency of voltage conversionis degraded.

On the other hand, the second field effect transistor Q2 for the lowside switch is configured so as not to produce such a switching loss asmentioned above. That is, when the first field effect transistor Q1 forthe high side switch is turned off, a current (second current) 121 flowsfrom a reference potential GND to a drain region DR2 of the second fieldeffect transistor Q2 through a parasitic diode D2 connected in parallelto the second field effect transistor Q2 for the low side switch. When agate voltage VgL is applied to its corresponding gate region G2 of thesecond field effect transistor Q2 for the low side switch to turn on itin this condition, a current (third current) I22 flows from a sourceregion SR2 of the second field effect transistor Q2 to the drain regionDR2 through a channel region of the second field effect transistor Q2.However, the current I21 has already flown before its current flow, andthe amount of change in current per unit time at the time that thecurrent I22 flows, is small. This is because a back electromotive forceproduced due to a parasitic inductance LsL is negligibly small and doesnot lead to a substantial loss.

Since the current (second current) I21 flows on ahead through theparasitic diode D2 connected in parallel to the second field effecttransistor Q2 for the low side switch, the switching loss is almostnegligible in the second field effect transistor Q2 for the low sideswitch. On the other hand, a parasitic diode D1 exists even in the firstfield effect transistor Q1 for the high side switch in a manner similarto above. However, the parasitic diodes D1 and D2 have anodes formedover their corresponding source SR1 and SR2 sides of the first andsecond field effect transistors Q1 and Q2 respectively and have cathodesformed over their corresponding drain region DR1 and DR2 sides of thefirst and second field effect transistors Q1 and Q2 respectively.Therefore, the first field effect transistor Q1 for the high side switchis not formed in the same direction (forward direction) as the current(first current) that flows from the drain region DR1 of the first fieldeffect transistor Q1 to the source region SR1 thereof. Thus, since nocurrent flows through the first field effect transistor Q1 before thegate voltage VgH is applied thereto to turn on it, the amount of changein current per unit time is not reduced, so that a switching loss isproduced.

The second field effect transistor Q2 is of a rectifying transistor ofthe non-insulated type DC-DC converter 1 and has the function oflowering the resistance thereof in sync with the frequency sent from thecontrol circuit 2. Therefore, a loss produced due to the on resistance,rather than the switching loss becomes remarkable since the on time ofthe second field effect transistor Q2 is longer than that of the firstfield effect transistor Q1. Thus, there is a need to reduce the onresistance. Since, however, the parasitic inductance LsL occurs betweenthe second field effect transistor Q2 and a terminal (second powersupply terminal) supplied with a reference potential GND, the onresistance increases and the efficiency of current conversion isdegraded.

With the main objective of avoiding the problem that the efficiency ofvoltage conversion of the non-insulated type DC-DC converter is degradeddue to the influences of the inductances LgH, LsH and LsL parasitized onthe source side of the above first field effect transistor Q1 for highside switch, the second field effect transistor Q2 for the low sideswitch is formed in another semiconductor chip (second semiconductorchip) 5 b different from a semiconductor chip (first semiconductor chip)5 a formed with the first field effect transistor Q1 for the high sideswitch as shown in FIG. 7 in the first embodiment. Since the drivercircuits (first and second control circuits) 3 a and 3 b are alternatelyoperated in sync with each other, the first and second control circuits3 a and 3 b are formed in the same semiconductor chip (thirdsemiconductor chip) 5 c in terms of stability of the whole circuitoperation.

Those semiconductor chips 5 a, 5 b and 5 c are resin-encapsulated ormolded in the same package 6 a. Thus, wiring inductances can be reduced.Further, the non-insulated type DC-DC converter 1 can be small-sized. Ifattention is paid to the wiring inductance alone here, then the firstfield effect transistors Q1 for the high side switch and the secondfield effect transistor Q2 for the low side switch may also preferablybe formed in the semiconductor chip 5 c. However, when they are formedin one semiconductor chip, a manufacturing process becomes complex andtheir element characteristics are not brought out sufficiently.Therefore, a problem also arises in that time is taken for theirmanufacture and the cost increases. Since the second field effecttransistor Q2 for the low side switch is longer in on time than thefirst field effect transistor Q1 for the high side switch, the secondfield effect transistor Q2 is easy to generate heat. Thus, there is alsoa fear that if the second field effect transistor Q2 for the low sideswitch is formed in the same semiconductor chip as the first fieldeffect transistor Q1 for the high side switch, heat generated at theoperation of the second field effect transistor Q2 for the low sideswitch exerts an adverse effect on the first field effect transistor Q1for the high side switch through a semiconductor substrate. In thepresent embodiment even from such a viewpoint, the semiconductor chip 5a formed with the first field effect transistor Q1 for the high sideswitch, the semiconductor chip 5 b formed with the second field effecttransistor Q2 for the low side switch, and the semiconductor chip 5 cformed with the first and second control circuits 3 a and 3 b are formedin their corresponding discrete semiconductor chips in parts. Thus, themanufacturing process of the non-insulated type DC-DC converter 1 can befacilitated as compared with the case in which the first field effecttransistor Q1 for the high side switch, the second field effecttransistor Q2 for the low side switch and the first and second controlcircuits 3 a and 3 b are formed in the same semiconductor chip. It istherefore possible to bring out the element characteristicssufficiently. Therefore, the time required to manufacture thenon-insulated type DC-DC converter 1 can be shortened and the cost forits manufacture can be reduced. Since the first field effect transistorQ1 for the high side switch and the first and second control circuits 3a and 3 b can be prevented from being adversely affected by the heatgenerated at the operation of the second field effect transistor Q2 forthe low side switch, the stability of operation of the non-insulatedtype DC-DC converter 1 can be improved.

The present inventors have found out that the parasitic inductancescannot be sufficiently reduced by merely placing the three semiconductorchips 5 a, 5 b and 5 c in their corresponding die pads 7 a 1, 7 a 2 and7 a 3 and resin-encapsulating them in the same package 6 a to improvethe efficiency of voltage conversion. A specific configurational exampleof the non-insulated type DC-DC converter 1 according to the firstembodiment shown in FIG. 7 will be explained with reference to FIGS. 8through 20.

FIG. 8 is a plan view showing a configurational example of the package 6a including some circuits of the non-insulated type DC-DC converter 1,FIG. 9 is a cross-sectional view taken along line Y1-Y1 of FIG. 8, FIG.10 is an assembly flow diagram showing a method for manufacturing thesemiconductor device shown in FIG. 8, FIG. 11 is a plan view showing aunit area of a lead frame, FIG. 12 is a plan view showing the backsurface of the lead frame shown in FIG. 11, FIG. 13 is a plan view ofthe unit area of the lead frame, showing one example of an assembledstate associated with a die bonding step of the assembly flow diagramshown in FIG. 10, and FIG. 14 is a plan view of the unit area of thelead frame, showing one example of an assembled state associated with awire bonding step of the assembly flow diagram shown in FIG. 10,respectively. FIG. 15 is an enlarged plan view showing the semiconductorchip 5 a shown in FIG. 8, FIG. 16 is a cross-sectional view taken alongline B-B of FIG. 15, FIG. 17 is a fragmentary enlarged cross-sectionalview of the semiconductor chip 5 b shown in FIG. 8, FIG. 18 is across-sectional view taken along line C-C of FIG. 15, FIG. 19 is anenlarged plan view of the semiconductor chip 5 b, FIG. 20 is anoutput-stage circuit configurational view of the semiconductor chip 5 cof FIG. 8, and FIG. 21 is a fragmentary cross-sectional view of thesemiconductor chip 5 c shown in FIG. 8, respectively. Incidentally, FIG.8 is shown excepting the semiconductor chips 5 a, 5 b and 5 c, die pads7 a 1, 7 a 2 and 7 a 3 and a resin molding or encapsulation body 8 oneach lead 7 b to make it easy to see the drawings. Further, the die pads7 a 1, 7 a 2 and 7 a 3, and leads 7 b are given hatching.

The package 6 a according to the first embodiment is set to, forexample, a QFN (Quad Flat Non-leaded package) configuration. However,the package is not limited to the QFN but can be changed in variousways. The package may be set as flat package configurations like, forexample, a QFP (Quad Flat Package), an SOP (Small Out line Package),etc. The package 6 a has three die pads (chip mounting members) 7 a 1, 7a 2 and 7 a 3, a plurality of leads (external terminals and inner leads)7 b 1, 7 b 2, 7 b 3 and 7 b 4, bonding wires (hereinafter simply calledwires) WR, and an encapsulating member (resin encapsulation body) 8. Thedie pad (first tab and first chip mounting section) 7 a 1, the die pad(second tab and second chip mounting section) 7 a 2, the die pad (thirdtab and third chip mounting section) 7 a 3 and the plural leads 7 b (7 b1, 7 b 2, 7 b 3 and 7 b 4) are respectively formed of a metal such as analloy. The wires WR is made up of, for example, gold (Au) or the like.The encapsulating member is formed of, for example, an epoxy resin.

As shown in FIG. 8, the die pads 7 a 1, 7 a 2 and 7 a 3 are respectivelyrectangular in shape and placed at predetermined intervals, andconstitute lead frames together with the plurality of leads 7 b. Thesemiconductor chip 5 a is placed (mounted) over the upper left die pad 7a 1 of FIG. 8 so as to approach one side of the die pad 7 a 1 adjacentto one side the die pad 7 a 2 in a state in which the main surface ofthe semiconductor chip 5 a is being turned up. The first field effecttransistor Q1 for the high side switch is formed in the main surface ofthe semiconductor chip 5 a as described above. A plurality of bondingpads (hereinafter simply called pads) BP are disposed in the mainsurface of the semiconductor chip 5 a as external terminals that draw ortake out electrodes for various circuits. Placing the semiconductor chip5 a so as to approach the die pad 7 a 2 in this way makes it possible toreduce the parasitic impedance LsH produced between the source of thefirst field effect transistor Q1 and the drain of the second fieldeffect transistor Q2. The semiconductor chip 5 b is placed over therelatively largest die pad 7 a 2 on the lower side of FIG. 8 so as toapproach the corner of the die pad 7 a 2 closer to a second power supplyterminal (terminal ET4 and plural leads 7 b 2 disposed along an L-letterline) than an output terminal in a state in which its main surface isbeing turned up. The second field effect transistor Q2 for the low sideswitch is formed over the main surface of the semiconductor chip 5 b asdescribed above. A plurality of electrode pads BP are disposed over themain surface of the semiconductor chip 5 b as external terminals thattake out electrodes for various circuits. Placing the semiconductor chip5 b so as to approach the corner of the second power supply terminal inthis way makes it possible to shorten a wiring length of each wire WRformed between the source of the second field effect transistor Q2 andthe second power supply terminal. It is thus possible to reduce a wiringresistance of each wire WR and further build up or strengthen areference potential GND. Further, the semiconductor chip 5 c is disposedover the upper right die pad 7 a 3 of FIG. 8 in such a manner that thedistance between the semiconductor chip 5 c and the semiconductor chip 5a becomes shorter than the distance between the semiconductor chip 5 cand the semiconductor chip 5 b in a state in which its main surface isbeing turned up. The first and second control circuits 3 a and 3 b areformed over the main surface of the semiconductor chip 5 c as describedabove. A plurality of electrode pads BP are disposed over the mainsurface of the semiconductor chip 5 c as external terminals that takeout or draw electrodes for various circuits. Placing the semiconductorchip 5 c in such a manner that the distance between the semiconductorchip 5 c and the semiconductor chip 5 a becomes shorter than thedistance between the semiconductor chip 5 c and the semiconductor chip 5b in this way makes it possible to reduce an inductance LgH producedbetween the gate of the first field effect transistor Q1 and thesemiconductor chip 5 c and improve a switching loss. By placing thesesemiconductor chips 5 a, 5 b and 5 c in their correspondingpredetermined positions of the die pads 7 a 1, 7 a 2 and 7 a 3, theefficiency of voltage conversion can be enhanced as compared with thesimple placement of the semiconductor chips 5 a, 5 b and 5 c in theircorresponding die pads 7 a 1, 7 a 2 and 7 a 3. Incidentally, thesemiconductor chips 5 a, 5 b and 5 c are respectively different in outersize (area) from the difference in characteristic. The outer size of thesemiconductor chip 5 a is formed larger than that of the semiconductorchip 5 c, whereas the outer size of the semiconductor chip 5 b is formedlarger than that of the semiconductor chip 5 a. The plurality ofelectrode pads BP are respectively formed of, for example, a metal likealuminum or the like. The semiconductor chip 5 c has first and secondcontrol circuits 3 a and 3 b. Since the first and second controlcircuits 3 a and 3 b are respectively of control circuits which controlthe gates of the first and second field effect transistors Q1 and Q2,the outer size of each element may preferably be set as small aspossible in consideration of the size of the whole package. On the otherhand, since the currents I1 and I2 flow through the first and secondfield effect transistors Q1 and Q2, an on resistance developed in eachtransistor may preferably be reduced as much as possible. In order toreduce the on resistance, its reduction can be realized by extending achannel width per unit cell area. To this end, the outer sizes of thesemiconductor chips 5 a and 5 b are formed larger than the outer size ofthe semiconductor chip 5 c. Further, as shown in FIG. 3, the secondfield effect transistor Q2 for the low side switch is longer in on timethan the first field effect transistor for the high side switch.Therefore, there is a need to further reduce the on resistance of thesecond field effect transistor Q2 for the low side switch as comparedwith the on resistance of the first field effect transistor Q1 for thehigh side switch. Thus, the outer size of the semiconductor chip 5 b isformed larger than the outer size of the semiconductor chip 5 a.

The electrode pads BP of the semiconductor chips 5 a, 5 b and 5 c areelectrically connected to their corresponding parts through the wiresWR. Of the electrode pads BP, for example, the corresponding sourceelectrode pad BP1 connected to the source of the first field effecttransistor Q1 of the semiconductor chip 5 a is electrically connected tothe die pad 7 a 1 through plural wires WR and electrically connected tothe electrode pad BP2 electrically connected to the source of the firstfield effect transistor Q1, of the plurality of electrode pads BP of thesemiconductor chip 5 c. The gate electrode pad BP3 connected to the gateof the first field effect transistor Q1 of the semiconductor chip 5 a iselectrically connected to its corresponding electrode pad BP4electrically connected to the gate of the first field effect transistorQ1, of the plural electrode pads BP of the semiconductor chip 5 cthrough plural wires WR. The source electrode pad BP5 connected to thesource of the second field effect transistor Q2 of the semiconductorchip 5 b is electrically connected to plural leads (second power supplyterminal) 7 b 2 through plural wires WR and electrically connected tothe electrode pad BP6 electrically connected to the source of the secondfield effect transistor Q2, of the plurality of electrode pads BP of thesemiconductor chip 5 c. The gate electrode pad BP7 connected to the gateof the second field effect transistor Q2 of the semiconductor chip 5 bis electrically connected to its corresponding electrode pad BP8electrically connected to the gate of the second field effect transistorQ2, of the plural electrode pads BP of the semiconductor chip 5 c. Theplural leads 7 b 2 are supplied with the reference potential GND throughthe terminal ET4. The respective back surfaces of the semiconductorchips 5 a and 5 b are configured as drain electrodes connected to thedrains of the first and second field effect transistors and electricallyconnected to the die pads 7 a 1 and 7 a 2. The die pad 7 a 1 iselectrically connected to the leads 7 b 1 formed integrally with it. Theleads 7 b 1 are electrically connected to their corresponding terminalET1 supplied with an input power supply potential Vin. The die pad 7 a 2is electrically connected to leads 7 b 3 formed integrally with it. Theleads 7 b 3 is electrically connected to their corresponding outputterminal ET5 that supplies an output power supply potential to theoutside. The coil L1 is electrically connected to the terminal ET5.Incidentally, for example, ultrasonic thermocompression bonding is usedin wire bonding for the wires WR. Therefore, since there is a fear thatif an ultrasonic wave is not successfully transferred to bondingportions of the die pads 7 a 1, 7 a 2 and 7 a 3, then a bonding failurewill occur, the wiring bonding is made in avoidance of a half etch areaas shown in FIG. 9. It is thus possible to suppress the bonding failure.

Although the semiconductor chips 5 a, 5 b and 5 c and the wires WR aresealed with the resin encapsulation body 8, the back surfaces (surfaceson the sides opposite to the chip mounting sections) of the die pads 7 a1, 7 a 2 and 7 a 3 and some of the plural leads 7 b are exposed to theoutside. Heat generated when the semiconductor chips 5 a, 5 b and 5 care operated, is radiated from the back surfaces of the semiconductorchips 5 a, 5 b and 5 c to the outside through the die pads 7 a 1, 7 a 2and 7 a 3 as viewed from their back surface sides. The respective diepads 7 a 1, 7 a 2 and 7 a 3 are formed larger than the areas of thesemiconductor chips 5 a, 5 b and 5 c. It is thus possible to improvedissipation of the non-insulated type DC-DC converter 1. Incidentally,the back surfaces (surfaces on the sides opposite to the surfaces overwhich the semiconductor chips 5 a, 5 b and 5 c are mounted) of the diepads 7 a 1, 7 a 2 and 7 a 3, and the back surfaces (surfaces on thesides opposite to the surfaces to which the wires WR are connected, andjoint surfaces bonded to terminals of a wiring board) of the leads 7 balso exist in the mounting surface (surface opposite to the wiring boardwhen the package 6 a is mounted over the wiring board) of the package 6a in such a structure.

A method for manufacturing the semiconductor device according to thefirst embodiment will next be described using the assembly flow diagramshown in FIG. 10.

First, a dicing tape is bonded onto a back surface of a semiconductorwafer. The semiconductor wafer is brought into fractionization by adicing blade to divide it into individual semiconductor chips 5 a, 5 band 5 c.

On the other hand, a lead frame 10 is prepared which has die pads 7 a 1,7 a 2 and 7 a 3 over which such semiconductor chips 5 a, 5 b and 5 c asshown in FIGS. 11 and 12 are mountable, and a plurality of leads 7 bplaced therearound, and in which peripheral portions of the backsurfaces of the die pads 7 a 1, 7 a 2 and 7 a 3 are formed thin by halfetching processing or the like.

Next, a die bonding step is performed. The semiconductor chips 5 a, 5 band 5 c are fixedly secured to the surface sides of the die pads 7 a 1,7 a 2 and 7 a 3 of the lead frame through a die bond material.

On the other hand, wires WR1 and WR2, which are 50 μm in thickness, forexample and which electrically connect the electrodes of thesemiconductor chips 5 a and 5 b and respective parts (leads and chipmounting sections) associated with the electrodes respectively, andwires WR3 which are 30 μm in thickness, for example and electricallyconnect the semiconductor chip 5 c and its corresponding respectiveparts (leads and chip's electrodes) respectively.

Next, a wire bonding step is carried out. The semiconductor chips 5 a, 5b and 5 c and their corresponding respective parts are connected(crimped) using wires (metal thin lines) WR such as a gold line by anultrasonic wave.

Thereafter, a resin encapsulating (mold) step is performed. At thistime, an encapsulating or sealing tape is first disposed over thesurface of a lower mold of a resin-molded die as shown in FIG. 10.Further, the lead frame 10 is placed over the sealing tape andthereafter the resin-molded die is clamped in such a manner that some ofthe plural leads 7 b and the die pads 7 a 1, 7 a 2 and 7 a 3 are adheredonto the sealing tape. Incidentally, one having high viscosity greaterthan or equal to, for example, 0.5N as the adhesive strength or force ofthe sealing tape is used as the sealing tape.

Subsequently, an encapsulating resin is injected into an upper mold(cavity), and the semiconductor chips 5 a, 5 b and 5 c and the pluralityof wires WR are resin-sealed in such a manner that some of the die pads7 a 1, 7 a 2 and 7 a 3 and some of the plurality of leads 7 b areexposed from a resin encapsulation body 8 (sealing member) to therebyform the resin encapsulation body 8 (mold step).

Finally, the implanted sealing resin is cured (resin cure step). Afterexecution of a mark step, product parts are divided from the lead frame10.

In the first embodiment, the sealing tape is bonded to the back surfaceof the lead frame 10 prior to the resin sealing step in the assemblyflow diagram shown in FIG. 10. This is done to prevent that in the resinsealing step of one having such a configuration that the plurality ofdie pads 7 a 1, 7 a 2 and 7 a 3 are provided within one package 6 a asin the first embodiment, the leakage of a resin is apt to occur in anintersecting portion Z of slits that form a boundary among the three diepads 7 a 1, 7 a 2 and 7 a 3 shown in FIG. 11, the resin (resin burrs)intruded into the back surfaces (mounting surfaces at the time that thepackage 6 a is packaged or mounted in the wiring board) of the die pads7 a 1, 7 a 2 and 7 a 3 through the intersecting portion Z, interfereswith the mounting of the package 6 a to thereby incur a failure inpackaging. Thus, in the first embodiment, the sealing tape is firmlybonded to the back surface sides (including the slits that form theboundary among the three die pads) of the three die pads prior to thesealing step so as not to cause the above resin leakage, therebypreventing the encapsulating resin from leaking to the back surfaces ofthe die pads 7 a 1, 7 a 2 and 7 a 3 through the intersecting portion Zor the like. It is therefore possible to prevent a failure in themounting of the package 6 a due to the resin burrs. Since it ispreferable to firmly adhere the sealing tape to the die pads 7 a 1, 7 a2 and 7 a 3 or the like upon the sealing step as described above, onecapable of obtaining a high viscosity strength of, for example, 0.5N ormore from such a viewpoint as the adhesive strength or force of thesealing tape is preferable as the sealing tape. On the other hand, alead frame 10 given nickel (Ni)/palladium (Pd)/gold (Au) flush plating,for example, has recently been used. This is because the lead frame 10given Pd (palladium) plating has the advantage that the use of lead-freesolder can be realized and good in environment upon mounting the package6 a to the wiring board, and while the commonly-used lead frame needs toapply silver (Ag) paste onto wire bonding portions of the lead frame forthe purpose of wiring bonding in advance, the present lead frame 10 hasthe advantage that wires can be connected even if such Ag paste is notapplied. Since, however, a problem about the failure in packaging due tothe above resin burrs arises even in the case of the Pd-plated leadframe 10, the removal of the resin burrs by a cleaning process or thelike is carried out where the resin burrs are formed. However, thePd-plated lead frame 10 is accompanied by a problem in that since thelead frame 10 is given plating prior to the resin sealing step to reducethe number of manufacturing process steps, the pre-plated Pd platingfilm is also peeled off when an attempt to peel away the resin burrs bythe cleaning process or the like is made. That is, there is apossibility that the Pd-plated lead frame 10 cannot be used. Incontrast, the first embodiment can prevent the formation of the resinburrs as described above and may not use a powerful cleaning processafter the sealing step. Therefore, the Pd-plated lead frame 10 havingthe satisfactory effect referred to above can be used.

Next, the lead frame 10 having such a unit area as shown in FIGS. 11 and12 is used in the first embodiment. As shown in FIG. 11, the die pads 7a 1, 7 a 2 and 7 a 3 are respectively rectangular in shape and placed atpredetermined intervals. The die pad 7 a 1 is electrically connected toits corresponding leads 7 b 1 formed integrally with it. The leads 7 b 1are electrically connected to their corresponding terminal ET1 (firstpower supply terminal and first source or power supply potential)supplied with an input power supply potential Vin. The die pad 7 a 2 iselectrically connected to its corresponding leads 7 b 3 formedintegrally with it. The leads 7 b 3 are electrically connected to theircorresponding output terminal ET5 (second power supply terminal andsecond source or power supply potential) that supplies an output powersupply potential to the outside. A plurality of leads (second powersupply terminal) 7 b 2 are formed so as to be connected in an L-shapedfashion along the periphery of the resin encapsulation body 8. Thus,since the volume increases as compared with division into the pluralleads 7 b owing to the formation of the leads 7 b 2 in the L form, areference potential GND can be enhanced or stepped up. Further, a halfetch area 11 is formed around the back surfaces of the die pads 7 a 1, 7a 2 and 7 a 3 as shown in FIG. 12. Forming the half etch area 11 (areagiven oblique hatching) in this way makes it possible to strengthenadhesion between the lead frame 10 and the resin encapsulation body 8.That is, it is possible to suppress or prevent lead omission. Inparticular, the thickness of the lead frame is also getting thin with ademand for a reduction in thickness and weight of a semiconductordevice. In addition to it, the leads 7 b are thin as compared with otherportions and their leading ends are in a floating state without beingconnected to other portions. Therefore, the lead portions might bedeformed or peeled where resin encapsulation is carried out withoutexecution of any means. Thus, the outer peripheral portions of the backsurfaces of the leads 7 b on the leading end sides thereof are alsohalf-etched to form steps at the outer peripheries of the back surfacesof the leads 7 b on their leading end sides. Thus, the encapsulatingresin flows into the half-etched portions upon the sealing step and thencovers the half-etched portions and holds down the tip outer peripheralportions of the leads 7 b. It is therefore possible to suppress orprevent deformation and peeling of the leads 7 b.

The die bonding step shown in FIG. 10 will be explained with referenceto FIG. 13 using the lead frame 10. As shown in S1-1 Step, asemiconductor chip 5 c is first die-bonded to its corresponding die pad7 a 3. Next, as shown in S1-2 Step, a semiconductor chip 5 a is disposedin its corresponding die pad 7 a 1. Finally, as shown in S1-3 Step, asemiconductor chip 5 b is placed in its corresponding die pad 7 a 3.Mounting the semiconductor chips 5 a, 5 b and 5 c small in outer size tothe die pads 7 a 3, 7 a 1 and 7 a 2 in that order in this way enables animprovement in productivity. Incidentally, although, for example, solderpaste is used to dispose the semiconductor chips 5 a, 5 b and 5 c in thedie pads 7 a 1, 7 a 2 and 7 a 3 respectively, it is omitted to make iteasy to see the drawings.

The wire bonding step shown in FIG. 10 will next be described withreference to FIG. 14. As shown in S2-1 Step, the semiconductor chip 5 aand the die pad 7 a 2 are first electrically connected by a plurality ofwires WR1 (first wire). Next, as shown in S2-2 Step, the semiconductorchip 5 b and the leads 7 b 2 (second power supply terminal) areelectrically connected by a plurality of wires WR2 (second wire).Finally, as shown in S2-3 Step, the semiconductor chip 5 c and itsassociated parts are electrically connected by a plurality of wires WR3(third wire). The wires WR1, WR2 and WR3 are respectively formed of, forexample, gold (Au) or the like. The wires WR1 and WR2 are 50 μm inthickness, for example. The thickness of each wire WR3 is 30 μm, forexample.

With an improvement in the efficiency of voltage conversion as a mainobject, the first embodiment provides a reduction in parasiticinductance LsH produced between the semiconductor chip 5 a and theoutput terminal and a reduction in parasitic inductance LsL producedbetween the semiconductor chip 5 b and each lead 7 b 2 (second powersupply terminal) for the purpose of its attainment. Thus, the pluralwires WR1 thicker than the wires WR3 are arranged to electricallyconnect the semiconductor chip 5 a and the die pad 7 a 2. The pluralityof wires WR2 thicker than the wires WR3 are arranged to electricallyconnect the semiconductor chip 5 b and the leads 7 b 2 (second powersupply terminal). Connecting them by arranging the thick wires WR1 andWR2 in plural form in this way makes it possible to reduce the parasiticinductances LsH and LsL produced in their wiring paths and also enhancethe reference potential GND. However, when the thick wires WR are bondedby an ultrasonic wave, a load larger than each thin wire WR3 isrequired. There is a fear that when the thick wires WR1 and WR2 areconnected after the thin wires WR3 are connected on ahead, thepreviously-connected thin wires WR3 will break due to the large load.When the die pads (chip mounting sections) 7 a 1, 7 a 2 and 7 a 3 areseparated from one another as in the first embodiment, a problem aboutthis breaking in particular arises remarkably. Therefore, in the firstembodiment, the wires WR2 are connected after the connection of thethick wires WR1 as shown in FIG. 14, and the thin wires WR3 areconnected after the connection of the wires WR2. It is thus possible tosuppress breaking of the wires WR1, WR2 and WR3. Incidentally, since thewires WR1 and the wires WR2 are identical in thickness, the wires WR1may be connected after the wires WR2 are previously connected.

Next, FIG. 15 is an enlarged plan view of the semiconductor chip 5 a,FIG. 16 is a cross-sectional view taken along line B-B of FIG. 15, FIG.17 is a cross-sectional view taken along line C-C of FIG. 15 and is afragmentary enlarged sectional view of the semiconductor chip 5 a, andFIG. 18 is a cross-sectional view taken along line C-C of FIG. 15,respectively.

The semiconductor chip 5 a is rectangular in flat shape intersecting itsthickness direction and is shaped in the form of, for example, arectangle in the first embodiment. Although the semiconductor chip 5 ais not limited to it, it has, for example, a semiconductor substrate 15,a plurality of transistor elements formed in a main surface Sax (seeFIG. 9 and the like) of the semiconductor substrate 15, a multilayerwiring layer in which an insulating layer 12 and a wiring layer 13 arerespectively stacked over the main surface of the semiconductorsubstrate 15 in plural stages, a surface protection film (finalprotection film) 14 formed so as to cover the wiring layer 13, etc. Thewiring layer 13 is constituted of a metal material like aluminum (Al),for example. The surface protection film 14 is formed of an organic filmlike a polyimide film (PiQ), for example.

The semiconductor chip 5 a has the main surface (circuit formingsurface) 5 ax and a back surface 5 ay both placed on the sides oppositeto each other (see FIG. 9 and the like). An integrated circuit isconfigured on the main surface 5 ax side of the semiconductor chip 5 a.The integrated circuit comprises transistor elements formed in the mainsurface 5 ax of the semiconductor substrate 15 and wirings formed in themultilayer wiring layer.

A plurality of electrode pads (electrodes) BP are formed in the mainsurface 5 ax of the semiconductor chip 5 a. The plural electrode pads BPinclude source electrode pads BP1 connected to the source and gate of afirst field effect transistor Q1, and a gate electrode pad BP3. They areexposed through bonding apertures 14 formed in the wiring layer 13corresponding to a top layer of the multilayer wiring layer of thesemiconductor chip 5 a and formed in the surface protection film 14 ofthe semiconductor chip 5 a in association with the respective electrodepads BP. As shown in FIG. 17, each source electrode pad BP1 is formedalong a pair of long sides (X direction) of the semiconductor chip 5 a.In the first embodiment, for example, two source electrodes extendface-to-face with each other. The gate electrode pad BP3 is formed in aposition near the center of one of a pair of short sides of thesemiconductor chip 5 a. A further description will be made. As shown inFIG. 8, the gate electrode pad BP3 is formed in a position near thecenter of the side closest to the output stage of the first controlcircuit 3 a of the semiconductor chip 5 c. In the first embodiment, theshape of the gate electrode pad BP3 is square and 280 μm, for example.The semiconductor chip 5 a has a gate electrode pattern electricallyconnected to the gate electrode pad BP3. The gate electrode patternextends from one (side connected to the gate electrode pad BP3) of thepair of short sides of the semiconductor chip 5 a to the other in the Xdirection and comprises a portion (first wiring and first portion) BPformed between the two source electrode pads BP1, and a portion (secondwiring and second portion) BP3 b formed along the periphery of the mainsurface of the semiconductor chip 5 a. In the first wiring BP3 a of thegate electrode pattern, an end thereof on the side opposite to one end(side to the gate electrode pad BP3) of one pair of short sides isformed so as not to be connected to some of the second wiring BP3 b. Thewidth of the gate electrode pattern is 25 μm, for example. The gateelectrode pattern is formed of a metal like aluminum (Al), for example.When the semiconductor chip 5 a and the die pad 7 a 2 are electricallyconnected by the plural wires WR1, they are placed in a zigzag form in aY direction with the first wiring interposed therebetween as shown inFIG. 8.

Since the semiconductor chip 5 a is shaped in the form of a rectangleextending in the X direction in this way, the source electrode pads BP1can also be disposed so as to approach the die pad 7 a 2 and along apair of long sides in addition to the viewpoint that the semiconductorchip 5 a is placed near the die pad 7 a 2 as described above (the longside of the semiconductor chip 5 a is placed in a state of extendingalong the long side of the die pad 7 a 2). Thus, since the wires WR1 forelectrically connecting the source electrodes BP1 and the die pad 7 a 2can be individually formed short in length, and more wires WR1 can beplaced side by side, the parasitic inductance LsH can be reduced. Sincethe end on the side opposite to one end (side connected to the gateelectrode BP3) of the pair of short sides in the first wiring BP3 a ofthe gate electrode pattern is formed so as not to be connected to partof the second wiring BP3 b, the source region SR1 of the first fieldeffect transistor Q1 can be formed without separation. That is, sincethe source region SR1 is formed without separation, the on resistancecan be reduced.

The two types of wires WR are electrically connected to the sourceelectrode pads BP1 of the semiconductor chip 5 a. The first typecorresponds to the wires WR1 electrically connected to the die pad 7 a2. The second type corresponds to wires WR3 a (WR3) that connect thesource of the first field effect transistor Q1 and the pads BP2 (BP)electrically connected thereto, of the plurality of electrode pads BP ofthe semiconductor chip 5 c. That is, the wires WR electrically connectedto the source electrode pads BP1 of the semiconductor chip 5 a areseparated into the die pad 7 a 2 side and the first control circuit 3 aside.

Thus, since paths for a current I11 (I1) that flows from the source ofthe first field effect transistor Q1 to the output terminal through thedie pad 7 a 2, and a current I12 (I1 b) that flows toward the firstcontrol circuit 3 a, can be dispersed, current loads developed in therespective wires WR can be reduced. Therefore, a further improvement inswitching loss can be performed since the parasitic inductance producedbetween the first field effect transistor Q1 and the first controlcircuit 3 a ca be reduced.

Next, FIG. 16 is a cross-sectional view taken along line B-B of thesemiconductor chip 5 a. The semiconductor substrate 15 of thesemiconductor chip 5 a comprises, for example, n⁺ type silicon (Si)monocrystalline. A drain electrode (external terminal) connected to thedrain region DR1 of the first field effect transistor Q1 is formed inits back surface. The drain electrode is formed by evaporating a metalsuch as gold (Au) and connected to the die pad 7 a 2 as described above.On the other hand, an epitaxial layer 16 ep formed of, for example, ntype silicon monocrystalline is formed in the main surface of thesemiconductor substrate 15. The epitaxial layer 16 ep is formed with ann⁻ type semiconductor region 17 n 1, p type semiconductor regions 17 pformed thereover, and n⁺ type semiconductor regions 17 n 2 formedthereover. For example, an n channel type vertical first field effecttransistor Q1 having a trench gate structure is formed in such asemiconductor substrate 15 and an epitaxial layer 16 ep. Further, awiring layer 13 b for a source region SR1 and a wiring layer 13 a for agate region G1 are formed thereover. A surface protection film 14 forprotecting the wiring layers 13 a and 13 b each corresponding to the toplayer is formed. Furthermore, a bonding aperture 14 a is defined in thesurface protection film 14, and each source electrode pad (externalterminal) BP1 connected to the source region SR1 exposed from thebonding aperture 14 a is formed. The gate region G1 is formed of, forexample, polysilicon (poly-Si). The source electrode pad BP1 is formedby evaporating a metal such as gold (Au) and connected with the wiresWR1 for electrically connecting to the die pad 7 a 2 as described above.

As shown in FIG. 17, the first field effect transistor Q1 has the n⁺type semiconductor region 17 n 2 having a function as the source regionSR1, the n⁻ type semiconductor region 17 n 1 having a function as thedrain region DR1, the p type semiconductor region 17 p having a functionas a channel forming region CH1, a gate insulating film 19 formed overan inner wall of a trench 18 dug or defined in the direction ofthickness of the epitaxial layer 16 ep, and a gate region G1 embeddedinto the trench 18 through the gate insulating film 19. The gate regionG1 is electrically connected to the gate electrode pad BP3. Owing to theadoption of such a trench gate structure, the unit area of the firstfield effect transistor Q1 can be miniaturized or scaled down andbrought into high integration. A cap insulating film 20 is formed overthe gate region G1 and insulates the source electrode pad BP1 and thegate region G1 from each other. The electrode pad BP1 is electricallyconnected even to the p type semiconductor region 17 p for channelformation as well as being connected to the n⁺ type semiconductor region17 n 2 for the source. The current I1 at the operation of the firstfield effect transistor Q1 flows between the source region SR1 and thedrain region DR1 along the depth direction of the trench 18 (flows inthe direction of thickness of drift layer) and along the side surfacesof the gate insulating film 19. Such a vertical first field effecttransistor Q1 is large in gate area per unit cell area and large in areaof junction of the gate region G1 and the drift layer of the drain ascompared with the horizontal field effect transistor in which thechannel is formed in the horizontal direction. Therefore, the parasiticcapacitance between the gate and drain becomes large, whereas a channelwidth per unit cell area can be increased and hence the on resistancecan be reduced.

The semiconductor chip 5 a is formed by arranging such a field effecttransistor as described in FIG. 17 in plural form as shown in FIG. 16.

Next, FIG. 18 is a cross-sectional view taken along line C-C (see FIG.15) of the semiconductor chip 5 a. The semiconductor substrate 15 of thefirst field effect transistor Q1 comprises, for example, n⁺ type siliconmonocrystalline. An epitaxial layer 16 ep constituted of, for example, ntype silicon monocrystalline is formed in the main surface of thesemiconductor substrate 15. Since the epitaxial layer 16 ep issubstantially identical in configuration to the above epitaxial layer,the description thereof will be omitted. Further, a p⁻ type well regionPWL is formed over the epitaxial layer 16 ep. A gate region (G-poly) G1is formed over the p⁻ type well region PWL with a field oxide film FLDinterposed therebetween. An insulating oxide film (SiO₂) 21 is formed inthe surface of the gate region G1. An aperture 21 a is defined in theinsulating oxide film 21, and a wiring layer 13 a connected to the gateregion G1 is formed through the aperture. The wiring layer 13 a is of agate electrode pad BP3. Further, a gate electrode (external terminal)connected to the gate electrode pad BP3 is formed. On the other hand, achannel region CH1 is formed in the side surface of the p-type wellregion PWL, and a wiring layer 13 b for each source region SR1 is formedover the channel region CH1. The wiring layer 13 b is of a sourceelectrode pad BP1. Further, each source electrode (external terminal)ET5 connected to the source electrode pad BP1 is formed. The wiringlayer 13 a of the gate region G1 and the wiring layer 13 b of the sourceregion SR1 are respectively of wiring layers each corresponding to a toplayer. Incidentally, the wiring layers 13 a and 13 b are respectivelyformed of a metal like aluminum (Al), for example.

Next, FIG. 19 shows an enlarged plan view of the semiconductor chip 5 b.Incidentally, since the semiconductor chip 5 b is substantiallyidentical in device configuration to the semiconductor chip 5 a, thedescription thereof will be omitted because it has already beendescribed in FIG. 15. Since the semiconductor chip 5 b is substantiallyidentical to FIGS. 16 through 18 in device's sectional configuration,the description thereof will be omitted because it has already beendescribed in FIGS. 16 through 18.

The semiconductor chip 5 b has a flat shape intersecting its thicknessdirection, which is rectangular. In the first embodiment, thesemiconductor chip 5 b is shaped in the form of a rectangle, forexample. A pair of long sides of the semiconductor chip 5 b and a pairof short sides thereof are respectively substantially the same size inXY ratio as two sides of plural leads 7 b 2 (second power supplyterminal) formed with being connected in an L-shaped fashion (see FIG.8). The semiconductor chip 5 b has a main surface (circuit formingsurface) 5 bx and a back surface 5 by located on the sides opposite toeach other. An integrated circuit is configured on the main surface 5 bxside of the semiconductor chip 5 b. The integrated circuit isprincipally configured of transistor elements formed in the main surface5 bx of the semiconductor substrate, and wirings formed in a multilayerwiring layer.

As shown in FIG. 19, a plurality of pads (electrodes) BP are formed inthe main surface 5 bx of the semiconductor chip 5 b. The pluralelectrode pads BP include source electrode pads BP5 connected to thesource of the second field effect transistor Q2 for the low side switchand gate electrode pads BP7 connected to the gate of the second fieldeffect transistor Q2. They are exposed through bonding apertures 22 adefined in a wiring layer corresponding to a top layer of the multilayerwiring layer of the semiconductor chip 5 b and defined in a surfaceprotection film 22 of the semiconductor chip 5 b in association with therespective electrode pads BP. The gate electrode pad BP7 electricallyconnected to the gate of the second field effect transistor Q2, of theplural electrode pads BP of the semiconductor chip 5 b is placed in aposition near the corner most adjacent to the semiconductor chip 5 cwithin the main surface of the semiconductor chip 5 b. Further, thesemiconductor chip 5 b has gate electrode patterns electricallyconnected to the gate electrode pads BP7. The gate electrode patternsextend in a Y direction from one (first power supply terminal ET1 side)of the pair of long sides of the semiconductor chip 5 b to the other(second power supply terminal ET4 side) thereof. The source electrodepads BP5 are placed among the plural gate electrode patterns and extendin the Y direction from the other of the pair of long sides of thesemiconductor chip 5 b to one thereof. A further description will bemade. The gate electrode patterns comprise portions (third wiring andthird portion) BP7 a formed among the source electrode pads BP5 andportions (fourth wiring and fourth portion) BP7 b formed along theperiphery of the main surface of the semiconductor chip 5 b. In thethird wiring BP7 a of each gate electrode pattern, the end of the other(second power supply terminal ET4 side) on the side opposite to a pairof long sides thereof is formed so as not to be connected to part of thefourth wiring BP7 b. The width of each gate electrode pattern is 25 μm,for example. The gate electrode pattern is constituted of a metal likealuminum (Al), for example. The source electrode pads BP5 and the pluralleads (second power supply terminal) 7 b 2 are electrically connected bya plurality of wires WR2.

A current supplied from the second control circuit 3 b flows to thesecond power supply terminal through the gate of the second field effecttransistor Q2. Therefore, when the gate electrode patterns are formed inthe X direction from one of the pair of short sides to the otherthereof, paths for the current flowing toward the plural leads 7 b 2placed along the long side are cut off or blocked. On the other hand,since the gate electrode patterns are formed so as to extend from one ofthe pair of long sides to the other thereof in the first embodiment,their current paths can be ensured. It is therefore possible to suppressdegradation of the efficiency of voltage conversion. Extensively formingthe source electrode pads BP5 over the semiconductor chip 5 b as shownin FIG. 19 makes it possible to connect a large number of the wires WR2electrically connected to the plural leads 7 b 2 that supply thereference potential GND. That is, parasitic impedance or inductance LsLproduced in each wiring path can further be reduced by connecting thelarge number of wires WR2. By making the outer size of the semiconductorchip 5 b substantially identical to the plural leads 7 b 2 formed in theL shape, the length of the connected plural wires WR2 can be shortened.That is, since they can be connected by the plural wires WR2substantially identical in length, variations in parasitic impedance LsLdeveloped in the wires WR2 can be suppressed. Thus, since a variation inthe magnitude of current flowing through each wire WR2 is hard to occur,the efficiency of voltage conversion can be improved.

A phenomenon (self turn-on) occurs wherein when the first field effecttransistor Q1 for the high side switch is switched to the second fieldeffect transistor Q2 for the low side switch, a current (throughcurrent) flows from the first power supply terminal ET1 to the secondpower supply terminal. Therefore, in the first embodiment, a thresholdvoltage VthH of the second field effect transistor Q2 for the low sideswitch is controlled by a value higher than a threshold voltage VthL ofthe first field effect transistor Q1 for the high side switch.Consequently, the path for the through current can be cut off. That is,the self turn-on can be suppressed.

Next, FIG. 20 is a circuit configurational diagram showing controlcircuits of the semiconductor device according to the first embodiment,and FIG. 21 is a cross-sectional view showing the corresponding controlcircuit of the semiconductor device shown in FIG. 20.

The semiconductor chip 5 c has first and second control circuits 3 a and3 b. The first control circuit 3 a is of a circuit which controls thegate of the first field effect transistor Q1 for the high side switch.The first control circuit 3 a comprises a plurality of field effecttransistors M1, M2, M3 and M4. Of the plural field effect transistorsM1, M2, M3 and M4, a section which controls the gate of the first fieldeffect transistor Q1 for the high side switch, corresponds to the fieldeffect transistors M1 and M2 equivalent to an output stage. The gate ofthe field effect transistor Q1 for the high side switch is controlled bysignals outputted from the field effect transistors M1 and M2. Thesection is supplied with a potential from the corresponding terminal(VCIN) ET2 that inputs a gate control voltage for the first field effecttransistor Q1 electrically connected to the drain of the field effecttransistor M1 of the output stage, and outputs a control signal. Aterminal ET6 for a bootstrap circuit, for controlling the gate of thefirst field effect transistor Q1 is connected to the drain of the fieldeffect transistor M1. Since the potential of the source of the firstfield effect transistor Q1 is a value (floating) higher than thereference potential GND, the voltage is supplied from the terminal ET6with respect to its voltage. Incidentally, although the first embodimenthas been explained using the four field effect transistors M1, M2, M3and M4, the present invention is not limited to it. Further, a pluralityof field effect transistors may be provided in the present embodiment.

The second control circuit 3 b is of a circuit for controlling the gateof the second field effect transistor Q2 for the low side switch andcomprises plural field effect transistors M5 and M6. The drain of thefield effect transistor M5 is supplied with a potential from itscorresponding terminal (VLDRV) ET3 that inputs a gate control voltagefor the second field effect transistor Q2, so that a control signal isoutputted. The second control circuit 3 b is substantially identical tothe first control circuit 3 a in circuit operation and the descriptionthereof will therefore be omitted.

Next, FIG. 21 shows a device structure of the control circuit describedin FIG. 20. Incidentally, since the second control circuit 3 b shown inFIG. 21 is substantially identical to the first control circuit 3 a indevice configuration, the first control circuit 3 a is explained hereand the description of the second control circuit 3 b is thereforeomitted.

The first field effect transistor Q1 is formed with a first controlcircuit 3 a formed of, for example, a CMOS (Complementary MOS) invertercircuit. The first control circuit 3 a is formed of a p channel typehorizontal third field effect transistor Q3 (whose channel is formed inthe horizontal direction (direction horizontal to the main surface ofthe semiconductor substrate)) formed in an n well NWL, and an n channeltype horizontal fourth field effect transistor Q4 formed in a p wellPWL. The third field effect transistor Q3 has a source region SR3, adrain region DR3, a gate insulating film 23 p and a gate region G3. Thesource region SR3 and the drain region DR3 respectively have p⁻ typesemiconductor regions 24 a and p⁺ type semiconductor regions 24 b. Thefourth field effect transistor Q4 has a source region SR4, a drainregion DR4, a gate insulating film 23 n and a gate region G4. The sourceregion SR4 and the drain region DR4 respectively have n⁻ typesemiconductor regions 25 a and type semiconductor regions 25 b. Thedrain regions DR3 and DR4 are respectively connected to an outputterminal ET7 and electrically connected to the gate of the first fieldeffect transistor for the high side switch through the output terminalET7. The source region SR4 is connected to an output terminal ET8 andelectrically connected to the source of the first field effecttransistor through the output terminal ET8.

The semiconductor chip 5 c has a square-shaped main surface and aplurality of pads (electrodes) BP disposed along the sides of thesquare-shaped main surface. Of the plural electrode pads BP of thesemiconductor chip 5 c, the electrode pads BP2, BP4, BP6 and BP8respectively electrically connected to the sources and gates of thefirst and second field effect transistors Q1 and Q2 are disposed alongthe two sides that define the corners of the main surface, most adjacentto the semiconductor chips 5 a and 5 b.

Thus, since the length of each of wires WR3 a, WR3 b, WR3 c and WR3 dcan further be shortened, the parasitic inductances LgH, LsH, LgL andLsL produced in the wiring paths can further be reduced. Since it isdesired to reduce the switching loss rather than the on resistance, thesemiconductor chips 5 are disposed in such a manner that the distancebetween the semiconductor chip 5 c and the semiconductor chip 5 abecomes shorter than the distance between the semiconductor chip 5 c andthe semiconductor chip 5 b. Even with respect to the wires WR3 a, 3 b, 3c and 3 d in addition to such a viewpoint, the wires WR3 a and 3 brespectively electrically connected to the source and gate of the firstfield effect transistor Q1 are formed shorter than the wires WR 3 c and3 d respectively electrically connected to the source and gate of thesecond field effect transistor Q2.

The second control circuit 3 b is of a circuit that controls the gate ofthe second field effect transistor Q2 for the low side switch. Further,the output stage of the second control circuit 3 b comprises pluralfield effect transistors M5 and M6 (fifth and sixth field effecttransistors). The fifth field effect transistor M5 is placed on the sideof one of the four sides of the semiconductor chip 5 c, most adjacent tothe semiconductor chip 5 b. Of the plural electrode pads BP of thesemiconductor chip 5 c, the source electrode pads BP9 (BP) connected tothe source of the fifth field effect transistor M5 are placed inside thesemiconductor chip 5 c as compared with other electrode pads BP.

Since the wiring resistance of each wire WR3 is lower than that ofwiring formed within each chip, the source electrode pads BP9 (BP)connected to the source of the fifth field effect transistor M5 areformed over the semiconductor chip 5 c. The wires WR3 are drawn andconnected up to the neighborhood of the source of the fifth field effecttransistor M5 so that the parasitic inductances developed in the wiringpaths can further be reduced.

Next, FIG. 22 is a plan view showing one example of a state of mountingof the package 6 a, and FIG. 23 is a side view of FIG. 22, respectively.

The wiring board 27 is formed of, for example, a printed wiring boardand has a main surface over which packages 6 a, 28 and 29, and chipparts 30 and 31 are mounted. The control circuit 2 is formed in thepackage 28 and the load circuit 4 is formed in the package 29. The coilL1 is formed as the chip part 30 and the condenser C1 is formed as eachchip part 31. Leads 28 a of the package 28 are electrically connected totheir corresponding leads 7 b (7 b 4) of the package 6 a through wirings27 a of the wiring board 27. Leads 7 b 1 of the package 6 a areelectrically connected to a wiring 27 b of the wiring board 27. Outputleads (output terminal) 7 b 3 of the package 6 a are electricallyconnected to one end of the coil L1 of the chip part 30 through a wiring(output wiring) 27 c of the wiring board 27. The other end of the coilL1 is electrically connected to the load circuit 4 through a wiring(output wiring) 27 d of the wiring board 27. Leads 7 b 2 for a referencepotential GND, of the package 6 a are electrically connected to one endsof the condensers C1 corresponding to the plural chip parts 31 through awiring 27 e of the wiring board 27. The other ends of the condensers C1are electrically connected to the load circuit 4 through the wiring 27 dof the wiring board 27.

Next, FIG. 24 is a plan view showing an overall surface of asemiconductor device according to one embodiment of the presentinvention, FIG. 25 is a side view of the semiconductor device shown inFIG. 24, FIG. 26 is a plan view showing a back surface of thesemiconductor device shown in FIG. 24, and FIG. 27 is an overallperspective view showing an external appearance of the semiconductordevice according to the one embodiment of the present invention,respectively.

As shown in FIG. 24, a resin encapsulation body 8 has a flat shapeintersecting its thickness direction, which is rectangular. In the firstembodiment, the resin encapsulation body 8 is shaped in the form of asquare identical in shape to the lead frame 10, for example. With theobjective of achieving a reduction in stress, the resin encapsulationbody 8 is formed of, for example, a biphenyl thermosetting resin addedwith a phenol curing agent, silicon rubber and filler or the like. As amethod for forming the resin encapsulation body, a transfer moldingmethod suitable for mass production is used. The transfer molding methodis a method of using a molding die (mold die) provided with a pot, arunner, a resin injection gate and a cavity or the like and injecting athermosetting resin into the cavity from the pot through the runner andthe resin injection gate to thereby form the resin encapsulation body 8.

Upon manufacture of an QFN type semiconductor device, there has beenused an individual type transfer molding method for using a multicavitywiring board having a plurality of product forming areas (device formingareas and product acquisition areas) and resin-encapsulatingsemiconductor chips mounted in the respective product forming areasevery product forming areas, or a batch type transfer molding method forusing a multicavity wiring board having a plurality of product formingareas and collectively resin-encapsulating semiconductor chips mountedin the respective product forming areas. In the first embodiment, forexample, the individual type transfer molding method is adopted.

As shown in FIGS. 25 and 26, some of plural leads 7 b are exposed fromthe side surfaces 8 c and back surface 8 b of the resin encapsulationbody 8. Back surfaces 7 a 1 y, 7 a 2 y and 7 a 3 y of die pads 7 a 1, 7a 2 and 7 a 3 are exposed from the back surface 8 b of the resinencapsulation body 8. Further, since the outer shapes of the die pads 7a 1, 7 a 2 and 7 a 3 are rectangular and lead frames placed atpredetermined intervals, the resin encapsulation body 8 is formed evenamong the die pads 7 a 1, 7 a 2 and 7 a 3. In addition, a positioningtaper R1 (index mark) is formed at one corner in the die pad 7 a 3.There is a fear that when the outer shapes of the die pads 7 a 1 and 7 a2 become small where one attempts to form the positioning taper R1 inthe die pads 7 a 1 and 7 a 2, it will exert an influence on currentcharacteristics because the currents I1 and I2 are supplied from thefirst and second power supply terminals. On the other hand, since nodynamic current flows in the die pad 7 a 3 and the potential is beingfixed, there is no need to worry about the current characteristics.Thus, the positioning taper R1 may preferably be formed in part of thedie pad 7 a 3. Incidentally, the taper R1 is used when the main and backsurfaces of the package 6 a are distinguished from each other, in thecase of, for example, face-to-face alignment at the shipment of thepackage 6 a and printing of a trademark on the package 6 a. The taper R1is formed by etching, for example.

Second Preferred Embodiment

FIG. 28 is a plan view showing one example of a package configuration ofa semiconductor device according to a second embodiment of the presentinvention. The semiconductor device described in FIG. 28 issubstantially similar to the semiconductor device shown in FIG. 8 inconfiguration but principally different therefrom in terms of the shapeof a gate electrode pad BP3 in a semiconductor chip 5 a, the shapes of agate electrode pad BP7 and a source electrode pad BP5 b in asemiconductor chip 5 b, portions covered with surface protection films14 and 22 in the semiconductor chips 5 a and 5 b, the shape of a sourcecell area, etc. Incidentally, FIG. 28 is also shown excepting thesemiconductor chips 5 a, 5 b and 5 c, die pads 7 a 1, 7 a 2 and 7 a 3and resin encapsulation body 8 placed over leads 7 b in order to make iteasy to see the drawing. Further, the die pads 7 a 1, 7 a 2 and 7 a 3and leads 7 b are given hatching.

In the second embodiment, a source electrode pad BP5 (BP5 a) connectedto the source of a second field effect transistor Q2 for a low sideswitch is shaped in an L-shaped fashion, for example along the sidesadjacent to a plurality of leads (second power supply terminal) 7 b 2 asshown in FIG. 28. That is, the source electrode pad BP5 a is formed onlyat a bonding section for wires WR2 electrically connected to theplurality of leads (second power supply terminal) 7 b 2. The sourceelectrode pad BP5 b of the semiconductor chip 5 b electrically connectedto a second control circuit 3 b of the semiconductor chip 5 c by wiresWR3 is formed on the side opposite to the side adjacent to the pluralleads (second power supply terminal) 7 b 2, of a pair of long sides ofthe semiconductor chip 5 b. Further, the outer size of the sourceelectrode pad BP5 b is formed in the same size as the outer size of anelectrode pad BP6 electrically connected to the source of the secondfield effect transistor Q2, of a plurality of electrode pads BP of thesemiconductor chip 5 c.

Thus, in the second embodiment, the ratio between the occupied areas ofthe source electrode pads BP5 a and BP5 b in the source cell area of thesemiconductor chip 5 a is reduced so that the major part of the sourcecell area, at least more than its half can be formed as an area coveredwith the surface protection film 22.

There is a possibility that since the force of adhesion between each ofthe source electrode pads BP5 formed of a metal like aluminum (Al), forexample and a resin encapsulation body 8 is lower than that between thesurface protection film 22 and the resin encapsulation body 8, they willbe peeled after the formation of the resin encapsulation body 8.However, according to the second embodiment in this way, the surfaceprotection film 22 is formed large and the areas of the source electrodepads BP5 a and BP5 b, which are exposed from the surface protection film22, are set smaller than the first embodiment. It is thus possible toreduce the area for contact between the source electrode pad BP5 and theresin encapsulation body 8. Therefore, the peeling of the resinencapsulation body 8 can be suppressed.

As shown in FIG. 28, the gate electrode pads BP3 and BP7 electricallyconnected to the gates of the first and second field effect transistorsQ1 and Q2 are formed in the same size as electrode pads BP4 and BP8electrically connected via the wires WR3 to the gates of the first andsecond field effect transistors Q1 and Q2, of the plural electrode padsBP of the semiconductor chip 5 c. Incidentally, the gate electrode padsBP3 and BP7 are respectively formed of a metal like aluminum (Al), forexample.

Thus, the outer sizes of the gate electrode pads BP3 and BP7 are setidentical to or smaller than the outer sizes of the electrode pads BP4and BP8 electrically connected the gates of the first and second fieldeffect transistors Q1 and Q2, of the plural electrode pads BP of thesemiconductor chip 5 c to thereby make it possible to increase the cellareas of the source regions SR1 and SR2 of the first and second fieldeffect transistors Q1 and Q2. It is therefore possible to further reducethe on resistance. That is, the efficiency of voltage conversion can beimproved.

Third Preferred Embodiment

FIG. 29 is a plan view showing one example of a package configuration ofa semiconductor device according to a third embodiment of the presentinvention. The semiconductor device described in FIG. 29 issubstantially similar to the semiconductor device shown in FIG. 8 inconfiguration but principally different therefrom in terms of a gateelectrode pattern in a semiconductor chip 5 a. Incidentally, FIG. 29 isalso shown excepting the semiconductor chips 5 a, 5 b and 5 c, die pads7 a 1, 7 a 2 and 7 a 3 and resin encapsulation body 8 placed over leads7 b in order to make it easy to see the drawing. Further, the die pads 7a 1, 7 a 2 and 7 a 3 and leads 7 b are given hatching.

In the third embodiment, the width of a portion (first wiring and firstportion) BP3 a formed between two source electrode pads BP1 in the gateelectrode pattern electrically connected to a gate electrode pad BP3 ofa first field effect transistor Q1 for a high side switch is formedthicker than the width of a portion (second wiring and second portion)BP3 b formed along the periphery of a main surface of the semiconductorchip 5 a. Incidentally, the width of the first wiring BP3 a of the gateelectrode pattern is 50 μm, for example. The width of the second wiringBP3 b of the gate electrode pattern is 25 μm, for example.

The first wiring BP3 a of the gate electrode pattern, which is formedbetween the two source electrode pads BP1, is a wiring which constitutesthe shortest gate current path of gate current paths from the gateelectrode pad BP3 to a channel forming area of a trench gate G1 in thefirst field effect transistor Q1.

Thus, since the width of the first wiring BP3 a is formed thicker thanthat of the second wiring BP3 b in the gate electrode pattern, a gateresistance can be reduced. If attention is paid only to the viewpointthat the gate resistance is reduced, then the width of the second wiringBP3 b of the gate electrode pattern may be expanded. However, when thewidth of the gate electrode pattern is increased, a source cell area isreduced. Since the on resistance of the first field effect transistor Q1increases due to the reduction in source cell area, the efficiency ofvoltage conversion is degraded. Thus, in the third embodiment, the widthof the first wiring BP3 constituting the shortest gate current path ofthe gate current paths from the gate electrode pad BP3 to the channelforming area of the trench gate G1 in the first field effect transistorQ1 is made larger than that of the second wiring BP3 b constitutingother gate current path to thereby enable a reduction in the resistanceof the shortest gate current path. Reducing the resistance of theshortest gate current path from the gate electrode pad BP3 in this waymakes it possible to improve fast responsivity at the turn-on operationof the first field effect transistor Q1 and enhance the efficiency ofvoltage conversion.

Fourth Preferred Embodiment

FIG. 30 is a plan view showing one example of a package configuration ofa semiconductor device according to a fourth embodiment of the presentinvention. The semiconductor device described in FIG. 30 issubstantially similar to the semiconductor device shown in FIG. 8 inconfiguration but principally different therefrom in terms of gateelectrode patterns in a semiconductor chip 5 b. Incidentally, FIG. 30 isalso shown excepting the semiconductor chips 5 a, 5 b and 5 c, die pads7 a 1, 7 a 2 and 7 a 3 and resin encapsulation body 8 placed over leads7 b in order to make it easy to see the drawing. Further, the die pads 7a 1, 7 a 2 and 7 a 3 and leads 7 b are given hatching.

The fourth embodiment has the feature that as shown in FIG. 30, theinterval or spacing of a third wiring BP7 a placed in a position fartherfrom a gate electrode pad BP7, in a plurality of third wirings BP7 a forthe gate electrode patterns is made wider than the interval of thecorresponding third wiring BP7 a placed in a position close to the gateelectrode pad BP7. A further description will be made. In sourceelectrode pads BP5 formed among the gate electrode patterns, the widthof the source electrode pad BP5 formed in a position far from the gateelectrode pad BP7 and adjacent to a second power supply terminal ET4(plural leads 7 b 2 disposed along an L-shaped line) is formed widerthan that of the source electrode pad BP5 formed near the gate electrodepad BP7.

Thus, since the path of current that flows toward the second powersupply terminal ET4 adjacent to a pair of short sides in thesemiconductor chip 5 b can be expanded, the on resistance can bereduced. That is, the efficiency of voltage conversion can be improved.

Fifth Preferred Embodiment

FIG. 31 is a plan view showing one example of a package configuration ofa semiconductor device according to a fifth embodiment of the presentinvention. The semiconductor device described in FIG. 31 issubstantially similar to the semiconductor device shown in FIG. 8 inconfiguration but principally different therefrom in terms of the layoutand number of wires WR connected to the source of a semiconductor chip 5a. Incidentally, FIG. 31 is also shown excepting the semiconductor chips5 a, 5 b and 5 c, die pads 7 a 1, 7 a 2 and 7 a 3 and resinencapsulation body 8 placed over leads 7 b in order to make it easy tosee the drawing. Further, the die pads 7 a 1, 7 a 2 and 7 a 3 and leads7 b are given hatching.

In the fifth embodiment as shown in FIG. 31, pads BP2 electricallyconnected to the source of the semiconductor chip 5 a, of a plurality ofelectrode pads BP of the semiconductor chip 5 c are disposed on bothsides adjacent to electrode pads BP4 electrically connected to the gateof the semiconductor chip 5 a.

Thus, the number of plural wires WR3 a that connect source electrodepads BP1 of the semiconductor chip 5 a and the electrode pads BP2electrically connected to the source of a first field effect transistorQ1, of the plural electrode pads BP of the semiconductor chip 5 c canfurther be increased. It is therefore possible to further reduce aparasitic inductance LsH produced in a wiring path between the source ofthe first field effect transistor Q1 and a first control circuit 3 a.The plural wires WR3 a that connect the source electrode pads BP1 of thesemiconductor chip 5 a and the electrode pads BP2 of the semiconductorchip 5 c, are formed substantially in parallel to a plurality of wiresWR3 b that connect the gate electrode pads BP4 of the semiconductor chip5 a and the electrode pads BP4 of the semiconductor chip 5 c. Therefore,a current feedback rate between the first field effect transistor Q1 andthe first control circuit 3 a can be increased. Therefore, the parasiticinductance LsH produced in the wiring path between the source of thefirst field effect transistor Q1 and the first control circuit 3 a canbe reduced, and fast responsivity of the first field effect transistorQ1 is improved, thereby making it possible to enhance the efficiency ofvoltage conversion.

The source electrode pad BP5 b (BP5) of the semiconductor chip 5 b andthe gate electrode pad BP7 are disposed so as to adjoin each other. Thatis, a plurality of wires WR3 c that connect the source electrode pad BP5b (BP5) of the semiconductor chip 5 b and the electrode pads BP6 of thesemiconductor chip 5 c, are formed side by side substantially inparallel to a plurality of wires WR3 d that connect the gate electrodepad BP7 of the semiconductor chip 5 b and the electrode pads BP8 of thesemiconductor chip 5 c.

Thus, since a current feedback rate between the second field effecttransistor Q2 and a second control circuit can be increased, the selfturn-off phenomenon can be suppressed. That is, the efficiency ofvoltage conversion can be enhanced.

Sixth Preferred Embodiment

FIG. 32 is a plan view showing one example of a package configuration ofa semiconductor device according to a sixth embodiment of the presentinvention, FIG. 33 is a cross-sectional view taken along line D-D ofFIG. 32, and FIG. 34 is an assembly flow diagram showing a method ofmanufacturing the semiconductor device according to the sixthembodiment, respectively. The semiconductor device described in FIG. 32is substantially similar to the semiconductor device shown in FIG. 8 inconfiguration but principally different therefrom in that surfaceprocessing using silver paste is partly effected on the surface of alead frame 40. Incidentally, FIG. 32 is also shown exceptingsemiconductor chips 5 a, 5 b and 5 c, die pads 7 a 1, 7 a 2 and 7 a 3and a resin encapsulation body 8 placed over leads 7 b in order to makeit easy to see the drawings. Further, the die pads 7 a 1, 7 a 2 and 7 a3 and leads 7 b are given hatching.

In the sixth embodiment, a paste material 41 constituted of, forexample, silver (Ag) is applied only onto a portion to be subjected towire boding in the lead frame 40 whose material comprises, for example,copper (Cu). Wires WR are formed of, for example, gold (Au).

Thus, the application of the paste material 41 like, for example, (Ag)onto the lead frame 40 enables wire bonding of the wires WR formed of,for example, gold (Au). Although the area to which silver paste isapplied, might be weak in the force of adhesion to the resinencapsulation body 8 as compared with copper or the like used as a baseor raw material for the lead frame 40, the area for contact between thelead frame 40 and the resin encapsulation body 8 can be sufficientlyensured owing to the application of the paste material 41 onto the wirebonding portion alone. It is therefore possible to improve the force ofadhesion between copper constituting the lead frame 40 and the resinencapsulation body 8.

When such a lead frame 40 as described in the sixth embodiment is used,a process step for removing resin burrs formed in back surfaces 7 a 1 y,7 a 2 y and 7 a 3 y of the die pads 7 a 1, 7 a 2 and 7 a 3 after theformation of the resin encapsulation body 8 is performed as shown inFIG. 34.

Next, a plating process step for effecting solder plating for packaginga semiconductor substrate on the plural leads 7 b and the back surfaces7 a 1 y, 7 a 2 y and 7 a 3 y of the die pads 7 a 1, 7 a 2 and 7 a 3 allexposed from the resin encapsulation body 8 is performed.

When the lead frame 40 formed of a copper (Cu) frame is used in thisway, a failure in the substrate packaging of the semiconductor devicedue to the resin burrs can be suppressed because plating is done afterthe formation of the resin encapsulation body 8. That is, thereliability of the semiconductor device can be enhanced.

Seventh Preferred Embodiment

As another problem caused by increases in current and frequency of a nonDC-DC converter, there is a problem about the reliability of thesemiconductor device subsequent to the formation of the resinencapsulation body 8. Since, in particular, the first through fifthembodiments respectively have explained such a configuration that theplurality of die pads 7 a 1, 7 a 2 and 7 a 3 given lead-free platinglike, for example, Ni/Pd/Au flush plating are accommodated or held inone package 6 a, a high adhesive force is required. The presentembodiment will explain a configuration which considers its adhesiveforce and takes into consideration preventive measures against leadomission.

FIG. 35 is a plan view illustrating one example of the surface side of aunit area of a lead frame 42 employed in a semiconductor deviceaccording to the seventh embodiment of the present invention, and FIG.36 is a plan view showing the back surface side of the lead frame shownin FIG. 35, respectively. Incidentally, half-etched areas are givenhatching in order to make it easy to see the drawings even in the caseof FIG. 36.

In the seventh embodiment, half etching is effected along peripheralportions of the back surfaces of the die pads 7 a 1, 7 a 2 and 7 a 3 inwhich their corresponding semiconductor chips 5 a, 5 b and 5 c areplaced. Further, cut-away portions (depressions and projections,recesses) 42 are formed in part of the half-etched area of the die pad 7a 2 and portions faced with a slit that forms the boundary among thethree die pads 7 a 1, 7 a 2 and 7 a 3. This is because the adhesionbetween the resin encapsulation body 8 and the lead frame is required inparticular at the slit that forms the boundary among the three die pads7 a 1, 7 a 2 and 7 a 3. Also this is done to enhance the force ofadhesion to the resin encapsulation body 8 by forming the cut-awayportions 43 so that a plurality of flat concavo-convex portions areformed in the slit. The cut-away portions are formed by etching, forexample.

According to the seventh embodiment in this way, the peripheral portionsof the die pads 7 a 1, 7 a 2 and 7 a 3 are half-etched and the cut-awayportions 43 are formed in some of the half-etch area of the die pad 7 a2. Consequently, the force of adhesion between the die pad 7 a 3 and theresin encapsulation body 8 becomes strong and the reliability of thesemiconductor device can further be improved as compared with the firstembodiment. That is, this results in a preventive measure against leadomission. Incidentally, the cut-away portions 43 are not limited to someof the half-etch area of the die pad 7 a 3. The cut-away portions 43 maybe formed in parts of the half-etch areas of the die pads 7 a 2 and 7 a3.

In the seventh embodiment, a taper R2 is formed at one corner on thesurface side of the die pad 7 a 1. The taper R2 is formed by etching,for example.

Thus, since a path for an input power supply potential Vin supplied froma first power supply terminal (leads 7 b 1) extends, parasitic impedanceLdH produced between the first power supply terminal and the drain of afirst field effect transistor Q1 for a high side switch can be reduced.That is, the efficiency of voltage conversion can be enhanced.

Eighth Preferred Embodiment

An eighth embodiment will explain a modification of the configurationfor the preventive measure against the lead omission.

FIG. 37 is a plan view illustrating one example of the surface side of aunit area of a lead frame 44 employed in a semiconductor deviceaccording to the eighth embodiment of the present invention, and FIG. 38is a plan view showing the back surface side of the unit area of thelead frame 44 shown in FIG. 37, respectively. Incidentally, half-etchedareas are given hatching in order to make it easy to see the drawingseven in the case of FIG. 38.

In the eighth embodiment, half etching is effected along peripheralportions of the back surfaces of the die pads 7 a 1, 7 a 2 and 7 a 3 inwhich their corresponding semiconductor chips 5 a, 5 b and 5 c areplaced. Further, cut-away portions (depressions and projections,recesses) 43 are formed in part of the half-etched area of the die pad 7a 3 and through holes (slits) 45 are defined in some of the die pads 7 a1, 7 a 2 and 7 a 3. The cut-away portions 43 are formed by etching, forexample. A trench 46 is defined in part of the surface of the die pad 7a 2. The trench 46 is formed by etching or punching, for example.

Thus, according to the eighth embodiment, the through holes 45 aredefined in the parts of the die pads 7 a 1, 7 a 2 and 7 a 3 to therebymake it possible to further strengthen the force of adhesion betweeneach of the die pads 7 a 1, 7 a 2 and 7 a 3 and the resin encapsulationbody 8 and further enhance the reliability of a semiconductor device ascompared with the seventh embodiment. A phenomenon (self turn-on) occurswherein when a first field effect transistor Q1 for a high side switchis switched to a second field effect transistor Q2 for a low sideswitch, a current (through current) flows from a first power supplyterminal ET1 to a second power supply terminal. Therefore, the path forthe through current can be cut off by forming the through holes 45between a portion to be wire-bonded from the semiconductor chip 5 a tothe die pad 7 a 2 and the semiconductor chip 5 b. It is thereforepossible to suppress the self turn-on. Further, a current (firstcurrent) I1 that flows when the first field effect transistor Q1 for thehigh side switch is turned on, becomes easy to flow toward an outputterminal. Since the strengths of the die pads 7 a 1, 7 a 2 and 7 a 3 arereduced as the number of the through holes 45 increases, the throughholes 45 may preferably be formed only at the positions where the selfturn-on is suppressed, as in the present embodiment.

On the other hand, since the trench 46 is formed on the side of theoutput terminal ET5 that supplies an output power supply potential tothe outside in the die pad 7 a 2, the force of adhesion between the diepad 7 a 2 and the resin encapsulation body 8 can also be improvedwithout cutting off the path for the current (first current) I1 suppliedto the outside. It is therefore possible to further enhance thereliability of the semiconductor device as compared with the seventhembodiment. This is effective in improving the adhesive force when thethrough holes 45 are formed. Since, however, the path for the current(first current) I1 supplied to the outside becomes narrow, theresistance increases. Thus, it is not preferable to form the throughholes 45 on the side of the output terminal ET5 that supplies the outputpower supply potential to the outside because the efficiency of voltageconversion is degraded.

Since the area of the die pad 7 a 2 is larger than that of thesemiconductor chip 5 b, the area for contact between the die pad 7 a 2and the resin encapsulation body 8 becomes large. Since the force ofadhesion between the die pad 7 a 2 and the resin encapsulation body 8 islower than that between the semiconductor chip 5 b and the resinencapsulation body 8, the formation of these through holes 45 and thetrench 46 are effective when the die pad 7 a 2 is larger than thesemiconductor chip 5 b. Incidentally, the trench 46 is not limited tosome of the surface of the die pad 7 a 2 but may be formed in respectiveparts on the surface sides of the die pads 7 a 1 and 7 a 3. The throughholes 45 and the trench 46 are not limited to such shapes as shown inFIG. 37.

Ninth Preferred Embodiment

A ninth embodiment will explain a modification of the configuration forthe preventive measure against the lead omission.

FIG. 39 is a plan view illustrating one example of the surface side of aunit area of a lead frame 47 employed in a semiconductor deviceaccording to the ninth embodiment of the present invention, and FIG. 40is a plan view showing the back surface side of the unit area of thelead frame 47 shown in FIG. 39, respectively. Incidentally, half-etchedareas are given hatching in order to make it easy to see the drawingseven in the case of FIG. 40.

In the ninth embodiment, half etching is effected along peripheralportions on the back surface sides of die pads 7 a 1, 7 a 2 and 7 a 3.Further, cut-away portions are formed in part of the half-etched areas.Cut-away portions are defined even in some of a second power supplyterminal formed in an L-shaped fashion and subjected to half etching. Atsome of plural leads 7 b, only side surface portions 11 a of theirleading ends are half-etched. The cut-away portions are formed byetching, for example.

According to the ninth embodiment in this way, the force of adhesionbetween each of the plural leads 7 b and a resin encapsulation body 8can also be further strengthened as well as enhancement of the force ofadhesion between each of the die pads 7 a 1, 7 a 2 and 7 a 3 and theresin encapsulation body 8. This means that engagement with the resinencapsulation body 8 is improved by forming the cut-away portions inhalf-etched areas of the die pads 7 a 1, 7 a 2 and 7 a 3 and pluralleads 7 b.

There is a fear that since an ultrasonic wave is not successfullytransferred to the half-etched areas upon wire bonding when the leadingends of the plural leads 7 b are also half-etched, a bonding failurewill occur. Therefore, only the side surfaces 11 a of the leading endsare half-etched without half-etching the leading ends of the pluralleads 7 b. Consequently, the force of adhesion to the resinencapsulation body 8 can be strengthened and the bonding failure canfurther be suppressed.

Tenth Preferred Embodiment

FIG. 41 is a plan view illustrating a configurational example of apackage 6 a including some circuits of a non-insulated type DC-DCconverter 1 according to a tenth embodiment of the present invention,and FIG. 42 is a cross-sectional view taken along line E-E of FIG. 41,respectively. Incidentally, FIG. 41 is also shown excepting a partialresin encapsulation body 8 in order to make it easy to see the drawing.Further, die pads 7 a 1, 7 a 2 and 7 a 3 and leads 7 b are givenhatching.

In the tenth embodiment, some of wirings for electrically connectingelectrode pads BP and respective parts are configured as metal platewirings 48 in place of the wires WR. That is, source electrode pads BP1of a first field effect transistor Q1 of a semiconductor chip 5 a areelectrically connected to the die pad 7 a 2 through one metal platewiring 48 a. Source electrode pads BP5 of a second field effecttransistor Q2 of a semiconductor chip 5 b are electrically connected toleads 7 b 2 (7 b) through one metal plate wiring 48 b. The metal platewiring 48 is formed of a metal like, for example, copper (Cu) oraluminum (Al) or the like and electrically connected to electrode padsBP and leads 7 b through bump electrodes 49. The bump electrodes 49 areformed of a metal like, for example, solder or gold (Au) or the like. Aconductive resin may be used in place of the bump electrodes 49. Themetal plate wiring 48 is also covered with a resin encapsulation body 8over its entirety.

According to the tenth embodiment in this way, the inductanceparasitized on each wiring path can further be reduced owing to the useof the metal plate wiring 48 in place of the wires WR. Therefore, aswitching loss can further be reduced and the efficiency of voltageconversion of the non-insulated type DC-DC converter 1 can be furtherimproved as compared with the first embodiment.

When attention is given only to the inductance parasitized on eachwiring path, the wires WR3 (WR) that electrically connect the pluralelectrode pads BP of first and second control circuits 3 a and 3 b andtheir respective parts, may preferably be formed of a metal plate wiring48 c (48). However, at the plural electrode pads BP of the first andsecond control circuits 3 a and 3 b, apertures therefor are narrow like90 μm, for example. Even if they are connected by the metal platewirings 48 in place of the wires WR, the metal plate wirings 48 narrowin width are used. Therefore, this does not lead to a reduction inparasitized inductance as compared with the wires WR. It is further hardto manufacture the metal plate wirings 48 of, for example, 100 μm orless. It is also difficult to connect the same as compared with thewires WR. Therefore, the cost of each product increases and the yieldthereof is reduced. Thus, it is not preferable to electrically connectthe plural electrode pads BP of the first and second control circuits 3a and 3 b and their respective parts by the metal plate wirings 48.

However, since it is desired to reduce the inductances parasitized onthe wiring paths between the first and second field effect transistorsQ1 and Q2 and the first and second control circuits 3 a and 3 b as shownin FIG. 8, a plurality of wires WR are connected side by side. In thiscase, the plurality of wires WR are combined into one metal plate wiring48. Consequently, the width of the metal plate wiring 48 is alsoexpanded to 200 μm, for example and the metal plate wiring may alsoelectrically be connected. Thus, the first and second field effecttransistors Q1 and Q2 and the first and second control circuits 3 a and3 b are electrically connected to one another by the metal plate wirings48 to reduce the parasitized inductances, so that the switching loss canbe improved.

Eleventh Preferred Embodiment

FIG. 43 is an assembly flow diagram showing a method for manufacturingthe semiconductor device according to the tenth embodiment of thepresent invention.

The eleventh embodiment adopts a batch type transfer molding method forusing a multicavity lead frame having a plurality of product formingareas and collectively resin-encapsulating the semiconductor chips 5 a,5 b and 5 c mounted in the respective product forming areas.

In the batch type transfer molding method, a resin encapsulation body 8is formed and thereafter the multicavity lead frame and the resinencapsulation body 8 are divided into plural pieces or fractions bydicing, for example. Accordingly, the resin encapsulation body 8 andlead frame employed in the eleventh embodiment are substantiallyidentical in outer size.

According to the eleventh embodiment as described above, a plurality ofsemiconductor devices can be obtained by one resin encapsulation. It istherefore possible to enhance product yields and reduce the cost of eachproduct as compared with the first embodiment.

Twelfth Preferred Embodiment

FIG. 44 is an assembly flow diagram showing a method for manufacturingthe semiconductor device according to the eleventh embodiment of thepresent invention.

In the present embodiment, a lead frame 10 is placed on a sealing tapeprior to at least a wiring bonding step. When the lead frame 10 havingthe die pads divided into plural form is used as in each of the aboveembodiments, the die pads become instable upon wire bonding, therebycausing a fear that a bonding failure will occur. Further, when thethick wires WR are wire-bonded as in the first embodiment, they areplaced under a higher load and connected by an ultrasonic wave, andhence the bonding failure is easy to further take place. There is a fearthat even upon a die bonding step, the die pads become instable andhence a failure in packaging will occur.

Thus, according to the twelfth embodiment, the lead frame 10 is placedover the sealing tape prior to the die bonding step to thereby stabilizethe respective die pads, whereby the failure in packaging and thefailure in wire bonding can be suppressed.

Thirteenth Preferred Embodiment

As a problem caused by increases in current and frequency of a non DC-DCconverter 1, may be mentioned a problem about heat at its operation.Since, in particular, the first through tenth embodiments respectivelyhave explained such a configuration that the three semiconductor chips 5a, 5 b and 5 c are accommodated or held in one package 6 a, highdissipation is required. The present embodiment will explain aconfiguration that has taken into consideration its dissipation.

FIG. 45 is a plan view illustrating a configurational example of apackage 6 a including some circuits of a non-insulated type DC-DCconverter 1 according to a thirteenth embodiment of the presentinvention, and FIG. 46 is a cross-sectional view taken along line F-F ofFIG. 45, and FIG. 47 is an overall plan view showing the surface side ofa semiconductor device according to the present embodiment,respectively. Incidentally, FIG. 45 is also shown excepting a partialresin encapsulation body 8 in order to make it easy to see the drawing.Further, die pads 7 a 1, 7 a 2 and 7 a 3 and leads 7 b are givenhatching.

In the thirteenth embodiment, a metal body 60 is bonded onto a mainsurface of a semiconductor chip 5 b, and part of the metal body 60 isexposed from the resin encapsulation body 8. The metal body 60 is formedof a metal high in thermal conductivity like, for example, copper oraluminum or the like and bonded to a source electrode pad BP5 of asemiconductor chip 5 b through solder or an adhesive material 61 formedof a conductive resin or the like. Since the semiconductor chip 5 b islonger than the semiconductor chip 5 a in on time as shown in FIG. 3,the semiconductor chip 5 b is apt to generate heat in particular.Therefore, the metal body 60 is disposed so as to cover an area forforming a second field effect transistor Q2 corresponding to a heatgeneration source of the semiconductor chip 5 b. In this structure, heatgenerated at the semiconductor chip 5 b is radiated into the wiringboard side through the die pad 7 a 2 from the back surface of thesemiconductor chip 5 b. In addition to it, the heat is radiated to theoutside through the metal body 60 even from the main surface of thesemiconductor chip 5 b as shown in FIGS. 46 and 47. Thus, highdissipation can be obtained. A further improvement in dissipation can becarried out by placing a radiating fin over the upper surface of thepackage 6 a and bonding it onto an exposed surface of the metal body 60.

Fourteenth Preferred Embodiment

The present embodiment will explain a modification of the heat radiationconstruction.

FIG. 48 is a plan view illustrating a configurational example of apackage 6 a including some circuits of a non-insulated type DC-DCconverter 1 according to the fourteenth embodiment of the presentinvention, FIG. 49 is a cross-sectional view taken along line G-G ofFIG. 48, and FIG. 50 is an overall plan view showing the surface side ofa semiconductor device according to the fourteenth embodiment,respectively. Incidentally, FIG. 48 is also shown excepting a partialresin encapsulation body 8 in order to make it easy to see the drawing.Further, die pads 7 a 1, 7 a 2 and 7 a 3 and leads 7 b are givenhatching.

In the fourteenth embodiment, some of wirings for electricallyconnecting electrode pads BP and respective parts are configured asmetal plate wirings 48 in place of the wires WR in a manner similar tothe tenth embodiment. Further, some of the metal plate wirings 48 areexposed from the resin encapsulation body 8. The metal plate wirings 48are disposed so as to cover areas for forming first and second fieldeffect transistors Q1 and Q2 corresponding to heat generation sources ofsemiconductor chips 5 a and 5 b in particular. Although the metal platewirings 48 a and 48 b on both sides of the semiconductor chips 5 a and 5b are exposed from the upper surface of the package 6 a in FIGS. 48through 50, such a configuration that only the metal plate wiring 48 bon the semiconductor chip 5 b side in which the second field effecttransistor Q2 for the low side switch relatively high in the amount ofgenerated heat is formed, may be adopted. Even in the presentembodiment, a further improvement in heat radiation can also be achievedby placing a radiating fin over the upper surface of the package 6 a andbonding it to an exposed surface of each metal plate wiring 48.

According to the fourteenth embodiment, each of the metal plate wirings48 is caused to have a radiating function in addition to advantageouseffects obtained at the tenth and thirteenth embodiments. Thus, there isno need to add other parts for radiation. Therefore, the number of theprocess steps for assembling the package 6 a can be reduced as comparedwith the thirteenth embodiment, and the time required to assemble thepackage 6 a can be shortened. Since the number of parts can bedecreased, the cost of the semiconductor device can be reduced.

Fifteenth Preferred Embodiment

The present embodiment will explain a modification of the heat radiationconstruction.

FIG. 51 is a plan view illustrating a configurational example of apackage 6 a including some circuits of a non-insulated type DC-DCconverter 1 according to the fifteenth embodiment of the presentinvention, FIG. 52 is a cross-sectional view taken along line H-H ofFIG. 51, and FIG. 53 is an overall plan view showing the surface side ofa semiconductor device according to the fifteenth embodiment,respectively. Incidentally, FIG. 51 is also shown excepting a partialresin encapsulation body 8 in order to make it easy to see the drawing.Further, die pads 7 a 1, 7 a 2 and 7 a 3 and leads 7 b are givenhatching.

In the fifteenth embodiment, some of wirings for electrically connectingelectrode pads BP and respective parts are configured as metal platewirings 48 in place of the wires WR in a manner similar to thefourteenth embodiment. Further, some of the metal plate wirings 48 areexposed from the resin encapsulation body 8. The metal plate wirings 48are disposed so as to cover areas for forming first and second fieldeffect transistors Q1 and Q2 corresponding to heat generation sources ofsemiconductor chips 5 a and 5 b in particular. Further, metal bodies 62are respectively bonded onto the surfaces of the die pads 7 a 1 and 7 a2, and some of the metal bodies 62 are exposed from the resinencapsulation body 8 as shown in FIGS. 51 through 53. In this structure,heat generated at the semiconductor chips 5 a and 5 b are radiated fromthe back surfaces of the semiconductor chips 5 a and 5 b to the wiringboard side through the die pads 7 a 1 and 7 a 2. Besides, the heat isradiated to the outside even from a main surface of the semiconductorchip 5 b through the metal plate wiring 48. Furthermore, the heat areradiated from the back surfaces of the semiconductor chips 5 a and 5 bto the outside of the resin encapsulation body 8 through the die pads 7a 1 and 7 a 2 and metal bodies 62. Thus, dissipation higher than thetwelfth and thirteenth embodiments can be obtained. The dissipation canbe further improved by placing a radiating fin over the upper surface ofthe package 6 a and bonding it onto an exposed surface of each metalbody 62.

According to the fifteenth embodiment, each metal plate wiring 48 iscaused to have a lead-omission preventing function in addition to theadvantageous effects obtained at the tenth, thirteenth and fourteenthembodiments. In the present embodiment, the areas of the die pads 7 a 1,7 a 2 and 7 a 3 are formed larger than those of semiconductor chips 5 a,5 b and 5 c. The semiconductor chips 5 a, 5 b and 5 c are respectivelydisposed so as to approach one sides of the die pads 7 a 1, 7 a 2 and 7a 3. Therefore, since any mounting-free large flat areas exist in thedie pads 7 a 1 and 7 a 2 in particular, the force of adhesion to theresin encapsulation body 8 is weak. Thus, the metal bodies 62 are placedover the die pads 7 a 1 and 7 a 2. Consequently, the force of adhesionbetween each of the die pads 7 a 1 and 7 a 2 and the resin encapsulationbody 8 can be made high as well as an improvement in radiating effect,thereby making it possible to further improve the reliability of thesemiconductor device.

While the invention made above by the present inventors has beendescribed specifically based on the embodiments, the present inventionis not limited to the embodiments. It is needless to say that variouschanges can be made without the scope not departing from the gistthereof.

Although the above embodiment has illustrated the flat package structureas the package structure, for example, the present invention is notlimited to it. For example, a BGA (Ball Grid Array) package structuremay be adopted.

In the above embodiment, for example, the DC-DC converter widely used asone example of the power circuit has been illustrated with the powerMOS·FET as an example. However, the present invention is not limited toit. A power MIS·FET (Metal Insulator Semiconductor Field EffectTransistor) structure with an insulating film intervened therein inplace of, for example, an oxide film may be adopted.

While the above description has principally been made of the case inwhich the invention made by the present inventors is applied to thepower circuit for control of CPU and DSP, which belongs to the field ofapplication reaching the background of the invention, the presentinvention is not limited to it but applicable in various ways. Thepresent invention can be applied even to a power circuit for control ofother circuit.

The present invention is applicable to the manufacturing industry of asemiconductor.

1-29. (canceled)
 30. A semiconductor device including a DC-DC converter,comprising: a first chip mounting portion having a first lead for use asan input for the DC-DC converter; a second chip mounting portion havinga second lead for use as an output for the DC-DC converter; a third chipmounting portion having a third lead; a fourth lead to supply a groundpotential to the DC-DC converter; a first semiconductor chip including ahigh side MOSFET of the DC-DC converter, the first semiconductor chipbeing mounted over the first chip mounting portion, the firstsemiconductor chip having an obverse surface, a reverse surface oppositethe obverse surface, a first side, and a second side intersecting thefirst side, the first semiconductor chip having a first gate electrodepad and a first source electrode pad on the top surface, and a firstdrain electrode on the bottom surface, the first drain electrode beingelectrically connected to the first chip mounting portion; a secondsemiconductor chip including a low side MOSFET of the DC-DC converter,the second semiconductor chip being mounted over the second chipmounting portion, the second semiconductor chip having an obversesurface, a reverse surface opposite the obverse surface, a first side,and a second side intersecting the first side, the second semiconductorchip having a second gate electrode pad and a second source electrodepad on the top surface, and a second drain electrode on the bottomsurface, the second drain electrode being electrically connected to thesecond chip mounting portion; a third semiconductor chip including afirst driver circuit to drive the high side MOSFET and a second drivercircuit to drive the low side MOSFET, the third semiconductor chip beingmounted over the third chip mounting portion, the third semiconductorchip having an obverse surface, a reverse surface, a first side, and asecond side intersecting the first side, the third semiconductor chiphaving a first electrode pad electrically connected to the first drivercircuit and a second electrode pad electrically connected to the seconddriver circuit; a sealing body sealing the first, second, and thirdsemiconductor chips, portions of the first, second, third, and fourthleads and portions of the first, second, and third chip mountingportions being exposed from the sealing body; a first conductivematerial connected to the first source electrode pad of the firstsemiconductor chip and the second chip mounting portion; and a secondconductive material connected to the second source electrode pad of thesecond semiconductor chip and the fourth lead, wherein the firstsemiconductor chip is disposed over the first chip mounting portion suchthat the first side of the first semiconductor chip faces the first sideof the third semiconductor chip, wherein the second semiconductor chipis disposed over the second chip mounting portion such that the secondside of the second semiconductor chip faces the second sides of thefirst and third semiconductor chips, wherein the gate electrode pad ofthe first semiconductor chip is connected to the first electrode pad ofthe third semiconductor chip via a first metal wire, wherein the gateelectrode pad of the second semiconductor chip is connected to thesecond electrode pad of the third semiconductor chip via a second metalwire, and wherein the first metal wire overlaps the first sides of thefirst and third semiconductor chips in plan view, and the second metalwire overlaps the second sides of the second and third semiconductorchips in plan view.
 31. A semiconductor device according to claim 30,wherein the first, second, and third semiconductor chips have quadrangleshapes in plan view, wherein the first semiconductor chip has a thirdside opposite the first side, wherein the second semiconductor chip hasa third side opposite the second side, wherein the third semiconductorchip has third and fourth sides opposite the first and second sides,respectively, wherein the first gate electrode pad is disposed on theobverse surface of the first semiconductor chip such that the first gateelectrode pad is closer to the first side of the first semiconductorchip than to the third side of the first semiconductor chip, wherein thesecond gate electrode pad is disposed on the obverse surface of thesecond semiconductor chip such that the second gate electrode pad iscloser to the second side of the second semiconductor chip than to thethird side of the second semiconductor chip, wherein the first electrodepad is disposed on the obverse surface of the third semiconductor chipsuch that the first electrode pad is closer to the first side of thesecond semiconductor chip than to the third side of the secondsemiconductor chip, and wherein the second electrode pad is disposed onthe obverse surface of the third semiconductor chip such that the secondelectrode pad is closer to the second side of the second semiconductorchip than to the fourth side of the second semiconductor chip.
 32. Asemiconductor device according to claim 30, wherein the first side ofthe second semiconductor chip is closer to the third semiconductor chipthan to the first semiconductor chip, and wherein the second gateelectrode pad is disposed at a corner formed by the first and secondsides of the second semiconductor chip.
 33. A semiconductor deviceaccording to claim 30, wherein the first conductive material connects anexposed part of second chip mounting portion between the first andsecond semiconductor chips.
 34. A semiconductor device according toclaim 33, wherein the first conductive material overlaps the second sideof the first semiconductor chip in plan view.
 35. A semiconductor deviceaccording to claim 30, wherein a part of the first source electrode padis disposed between the third side of the first semiconductor chip andthe first gate electrode pad of the first semiconductor chip in planview.
 36. A semiconductor device according to claim 30, wherein at leastone of the first conductive material and the second conductive materialis a metal plate.
 37. A semiconductor device according to claim 30,wherein at least one of the first conductive material and the secondconductive material is a plurality of metal wires.
 38. A semiconductordevice according to claim 30, wherein the first metal wire is disposedso as to overlap in plan view the first side of the first semiconductorchip.
 39. A semiconductor device according to claim 38, wherein thesecond side of the first semiconductor chip is longer than the firstside of the first semiconductor chip.
 40. A semiconductor deviceaccording to claim 30, wherein the second metal wire is disposed so asto overlap in plan view the second side of the second semiconductorchip.
 41. A semiconductor device according to claim 40, wherein thefirst semiconductor chip has a third side intersecting the second sideand a fourth side intersecting the first side, the second and fourthsides each being longer than the first side of the second semiconductorchip.
 42. A semiconductor device according to claim 41, wherein thesecond semiconductor chip has a rectangular shape in plan view, secondside is a long side of the rectangular shape, and the first side is ashort side of the rectangular shape.
 43. A semiconductor deviceaccording to claim 30, wherein the first gate electrode pad of the firstsemiconductor chip is exposed from the first conductive material, andwherein the second gate electrode pad of the second semiconductor chipis exposed from the second conductive material.
 44. A semiconductordevice according to claim 30, wherein respective widths of the first andsecond conductive materials are greater than respective diameters of thefirst and second metal wires.
 45. A semiconductor device according toclaim 30, wherein the first and second conductive materials arecomprised of copper.
 46. A semiconductor device according to claim 30,wherein the sealing body has a top surface and a bottom surface oppositethe top surface, and wherein the exposed portions of the first, second,and third chip mounting portions are exposed from the bottom surface ofthe sealing body.
 47. A semiconductor device according to claim 30,wherein the sealing body has a pair of first side surfaces and a pair ofsecond side surfaces intersecting the first side surfaces, and whereinthe fourth lead is disposed along one of the first side surfaces and oneof the second side surfaces of the sealing body.
 48. A semiconductordevice according to claim 30, wherein the fourth lead is disposed aroundthe second chip mounting portion and has a first portion thereofopposite the first side of the second semiconductor chip, and a secondportion thereof opposite the second side of the second semiconductorchip, and wherein the second conductive material is coupled to the firstand second portions of the fourth lead.